是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | VFBGA, | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 15 weeks | 风险等级: | 1.64 |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PBGA-B63 | 长度: | 4.1 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 63 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
座面最大高度: | 0.57 mm | 最大供电电压 (Vsup): | 3 V |
最小供电电压 (Vsup): | 2.5 V | 标称供电电压 (Vsup): | 2.65 V |
表面贴装: | YES | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3.2 mm | Base Number Matches: | 1 |
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