是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA64,10X10,20 | 针数: | 64 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.6 | Is Samacsys: | N |
其他特性: | ALSO REQUIRES 1.62V TO 3.3V IO SUPPLY | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-XBGA-B64 | JESD-609代码: | e1 |
长度: | 5.3 mm | 功能数量: | 1 |
端子数量: | 64 | 最高工作温度: | 85 °C |
最低工作温度: | -30 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | VFBGA | 封装等效代码: | BGA64,10X10,20 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 2.5 V |
认证状态: | Not Qualified | 座面最大高度: | 1 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 33 mA |
最大供电电压 (Vsup): | 4.5 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 3.6 V | 表面贴装: | YES |
温度等级: | OTHER | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 10 |
宽度: | 5.3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
BD6025GU_09 | ROHM | Silicon Monolithic Integrated Circuit |
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BD6025GU-E2 | ROHM | Power Management Circuit, PBGA64, |
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BD6026GU | ROHM | Power supply for CCD camera/White LED driver/RGB LED driver of mobile phone |
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BD6026GU_09 | ROHM | Silicon Monolithic Integrated Circuit |
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BD6028GU | ROHM | Power supply for CCD camera of mobile phone |
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BD6029GU | ROHM | Silicon Monolithic Integrated Circuit |
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