Datasheet > BD5309G-2M

BD5309G-2M

更新时间： 2023-09-03 20:24:52

品牌	Logo	应用领域
罗姆 - ROHM		电容器
页数	文件大小	规格书
23页	2305K
描述
罗姆的延迟时间自由设置型CMOS电压检测器IC系列是内置了采用CMOS工艺的高精度、低消耗电流延迟电路的CMOS RESET IC系列。可通过外接电容器设定延迟时间。为保证客户可根据应用进行选择，备有Nch漏极开路输出(BD52xx-2M)系列和CMOS输出(BD53xx-2M)系列产品。备有检测电压为0.9V～5.0V的0.1V阶跃的产品阵容。在-40°C到105°C的整个工作温度范围内，将延迟时间精度控制在±30%内。

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BD5309G-2M 数据手册

BD52xx-2M Series BD53xx-2M Series

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Line

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all

power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on

the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line

impedance.

5. Thermal Consideration

Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may

result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the

board size and copper area to prevent exceeding the maximum junction temperature rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of

connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line

www.rohm.com

TSZ02201-0GIG0G300010-1-2

17/20

TSZ22111・15・001

05.Jul.2018 Rev.002

1...14 15 161718 19 20...23

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BD53107G-CZ (开发中)	ROHM	获取价格	BD53107G-CZ is S pole detection Hall IC with wide VDD voltage range and wide operation tem
BD53108G-CZ (新产品)	ROHM	获取价格	BD53108G-CZ is S pole detection Hall IC with wide VDD voltage range and wide operation tem
BD5310G-2C	ROHM	获取价格	Free Time Delay Setting CMOS Voltage Detector (Reset) IC
BD5310G-2CTR	ROHM	获取价格	Free Time Delay Setting CMOS Voltage Detector (Reset) IC
BD5310G-2M	ROHM	获取价格	罗姆的延迟时间自由设置型CMOS电压检测器IC系列是内置了采用CMOS工艺的高精度、低消耗
BD5311G-2C	ROHM	获取价格	Free Time Delay Setting CMOS Voltage Detector (Reset) IC

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