BD52xx-2M Series BD53xx-2M Series
Operational Notes – continued
12. Regarding Input Pins of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply
voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages
within the values specified in the electrical characteristics of this IC
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
15. Bypass Capacitor for Noise Rejection
To help reject noise, put more than 0.1µF capacitor between VDD pin and GND. Be careful when using extremely big
capacitor as transient response will be affected.
16. The VDD line impedance might cause oscillation because of the detection current.
17. A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
18. External Parameters
The recommended value of CT Capacitor is from open to 4.7µF and pull-up resistance value is 50kΩ to 1MΩ. There are
many factors (board layout, etc) that can affect characteristics. Operating beyond the recommended values does not
guarantee correct operation. Please verify and confirm using practical applications.
19. When VDD falls below the minimum operating voltage, output will be open. When output is connected to pull-up voltage,
output will be equivalent to pull-up voltage.
20. Power-on Reset Operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
21. CT Pin Discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
22. This IC has extremely high impedance pins. Small leak current due to the uncleanness of PCB surface might cause
unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed
between the CT and GND pin, it is recommended to insert 1MΩ resistor between CT and VDD pin. However, delay time
will change when resistor is connected externally to CT pin so verify the delay time requirements when using this set-up.
Also, when similar leakage is assumed between VOUT and GND pin, consider to set the value of pull up resistor lower
than 1/10 of the impedance of assumed leakage route.
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TSZ22111・15・001
05.Jul.2018 Rev.002