BD26502GUL

更新时间： 2024-11-07 08:51:19

品牌	Logo	应用领域
罗姆 - ROHM		显示驱动器驱动程序和接口接口集成电路
页数	文件大小	规格书
40页	725K
描述
7x17(Max.) Dot Matrix LED Display Driver

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中文翻译

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技术参数
数据手册

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BD26502GUL 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	VFBGA,
针数：	50	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.73	Is Samacsys：	N
数据输入模式：	SERIAL	显示模式：	DOT MATRIX
接口集成电路类型：	LED DISPLAY DRIVER	JESD-30 代码：	S-PBGA-B50
JESD-609代码：	e1	长度：	4.1 mm
复用显示功能：	NO	功能数量：	1
区段数：	119	端子数量：	50
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	VFBGA
封装形状：	SQUARE	封装形式：	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
认证状态：	Not Qualified	座面最大高度：	0.55 mm
最大供电电压：	5.5 V	最小供电电压：	2.7 V
标称供电电压：	3.6 V	表面贴装：	YES
温度等级：	INDUSTRIAL	端子面层：	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：	BALL	端子节距：	0.5 mm
端子位置：	BOTTOM	宽度：	4.1 mm
最小 fmax：	0.1 MHz	Base Number Matches：	1

BD26502GUL 数据手册

System LED Drivers for Mobile Phones

7x17(Max.) Dot Matrix

LED Display Driver

BD26502GUL

No.10041EAT01

●Description

BD26502GUL is “Matrix LED Driver” that is the most suitable for the cellular phone.

It can control 7x17(119 dot) LED Matrix by internal 7-channel PMOS SWs and 17-channel LED drivers.

It can control the luminance and firefly lighting of the LED matrix by the setting of the internal register.

It supports SPI and I2C interface.

VCSP50L4 (4.1mm^□0.55mm height max), small and thin type chip size package.

It adopts the very thin CSP package that is the most suitable for the slim phone.

●Features

1) LED Matrix driver (7x17)

・It has 7-channel PMOS SWs and 17-channel current drivers with 1/7 timing driven sequentially.

・Put ON/OFF(for every dot).

・The current drivers can drive 0-20.00mA current with 16 step(for every dot).

・64 steps of the luminance control by PWM (common setting for all dots)

・Continuous (TDMA off ) lighting function for LED14-LED17

・Easy register setting by A/B 2-side map for each dot.

2) Automatic Slope function

・Cycle time, Slope time can be set for each dot.

3) 8-direction automatic scroll function.

4) Interface

・SPI and I²C BUS FS mode(max 400kHz)Compatibility

・For I²C mode, I²C Device address is selectable (74h or 75h)

5) Thermal shutdown

6) Small and thin CSP package

・62pin VCSP50L4(4.1mm²0.55mm height max)

*This chip is not designed to protect itself against radioactive rays.

*This material may be changed on its way to designing.

*This material is not the official specification.

●Absolute Maximum Ratings (Ta=25 ^oC)

Parameter

Maximum voltage (note2)

Maximum voltage (note1)

Power Dissipation (note3)

Operating Temperature Range

Storage Temperature Range

Symbol

VMAX

VIOMAX

Ratings

Unit

4.5

1550

℃

Topr

-40 ~ +85

-55 ~ +150

Tstg

℃

note1) VIO,RESETB,CE,SDA,SCL,IFMODE,SYNC,CLKIN,CLKOUT,TEST1,TEST2,TEST3,TESTO, DO terminal

note2) Except the above

note3) Power dissipation deleting is 12.4mW/ ^oC , when it’s used in over 25 ^oC. (ROHM’s standard board has been mounted.)

The power dissipation of the IC has to be less than the one of the package.

●Operating Conditions (VBAT≥VIO, VINSW≥VBAT, Ta=-40~85 ^oC)

Parameter

VBAT input voltage

Symbol

VBAT

VINSW

VIO

Limits

Unit

2.7 ~ 5.5

1.65 ~ 3.3

VINSW input voltage

VIO pin voltage

www.rohm.com

2010.02 - Rev.A

1/39

12 3 4 5 6 7...40

中文翻译

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与BD26502GUL相关器件

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