Datasheet > BD2311NVX-LB

BD2311NVX-LB

更新时间： 2024-04-09 19:01:29

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BD2311NVX-LB 数据手册

BD2311NVX-LB

Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

Rating

Unit

Supply Voltage

VCC

V_IN+

-0.3 to +6.5

-5.0 to +7.0

150

Input Voltage (IN+)

Input Voltage (EN)

V_EN

Maximum Junction Temperature

Tjmax

°C

Storage Temperature Range

Tstg

-55 to +150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

SSON06RX2020

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

284.5

35.0

83.2

22.0

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A (Still-Air).

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

Thermal Via^{(Note 5)}

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

(Note 5) This thermal via connect with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-03E3AAU00080-1-2

14.Apr.2023 Rev.001

3/16

1 234 5 6 7...19

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