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BC807-40-TP PDF预览

BC807-40-TP

更新时间: 2024-11-25 21:21:03
品牌 Logo 应用领域
美微科 - MCC 光电二极管晶体管
页数 文件大小 规格书
3页 287K
描述
Small Signal Bipolar Transistor, 0.5A I(C), 45V V(BR)CEO, 1-Element, PNP, Silicon, ROHS COMPLIANT, PLASTIC, PACKAGE-3

BC807-40-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-G3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:0.57
最大集电极电流 (IC):0.5 A集电极-发射极最大电压:45 V
配置:SINGLE最小直流电流增益 (hFE):250
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:PNP最大功率耗散 (Abs):0.3 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:10晶体管元件材料:SILICON
标称过渡频率 (fT):100 MHzBase Number Matches:1

BC807-40-TP 数据手册

 浏览型号BC807-40-TP的Datasheet PDF文件第2页浏览型号BC807-40-TP的Datasheet PDF文件第3页 
BC807-16  
BC807-25  
BC807-40  
M C C  
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20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
·
Halogen free available upon request by adding suffix "-HF"  
PNP Silicon  
General Purpose  
Transistors  
·
Lead Free Finish/RoHS Compliant ("P" Suffix designates  
RoHS Compliant. See ordering information)  
Capable of 0.3Watts of Power Dissipation.  
Collector-current 0.5A  
Collector-base Voltage 50V  
Operating and storage junction temperature range: -55OC to +150OC  
·
Epoxy meets UL 94 V-0 flammability rating  
·
Moisure Sensitivity Level 1  
SOT-23  
Mechanical Data  
A
D
Case: SOT-23 Molded Plastic  
Terminals: Solderable per MIL-STD-202, Method 208  
Weight: 0.008 grams (approx.)  
3
C
B
C
Device Marking:  
BC807-16  
BC807-25  
BC807-40  
5A  
5B  
5C  
E
B
F
E
Electrical Characteristics @ 25OC Unless Otherwise Specified  
Symbol  
Parameter  
Min  
Max  
Units  
H
G
J
OFF CHARACTERISTICS  
V(BR)CEO  
V(BR)CBO  
V(BR)EBO  
ICBO  
Collector-Emitter Breakdown Voltage  
45  
50  
5.0  
---  
---  
---  
---  
---  
Vdc  
Vdc  
(I =10mAdc, IB=0)  
K
C
Collector-Base Breakdown Voltage  
DIMENSIONS  
(I =10µAdc, IE=0)  
C
INCHES  
MIN  
MM  
Collector-Emitter Breakdown Voltage  
---  
Vdc  
DIM  
A
B
C
D
E
MAX  
MIN  
2.80  
2.10  
1.20  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
NOTE  
.110  
.083  
.047  
.035  
.070  
.018  
.120  
.104  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
(I =1.0µAdc, IC=0)  
E
Collector Cutoff Current  
0.1  
0.2  
0.1  
µAdc  
µAdc  
µAdc  
(VCB=45Vdc,I =0)  
E
1.78  
.45  
ICEO  
Collector Cutoff Current  
F
(VCE=40V dc,I =0)  
E
G
H
J
.0005  
.035  
.003  
.015  
.013  
.89  
IEBO  
Emitter Cutoff Current  
.085  
.37  
(VEB=4.0Vdc, I =0)  
C
K
ON CHARACTERISTICS  
hFE(1)  
DC Current Gain  
Suggested Solder  
Pad Layout  
(I =100mAdc, VCE=1.0Vdc)  
C
BC807-16  
BC807-25  
BC807-40  
100  
160  
250  
40  
---  
---  
250  
400  
600  
---  
---  
---  
---  
Vdc  
Vdc  
.031  
.800  
.035  
.900  
hFE(2)  
VCE(sat)  
VBE(sat)  
DC Current Gain  
---  
(I =500mAdc, VCE=1.0Vdc)  
C
.079  
2.000  
inches  
mm  
Collector-Emitter Saturation Voltage  
0.7  
1.2  
(I =500mAdc, IB=50mAdc)  
C
Base-Emitter Saturation Voltage  
(I =500mAdc,IB=50mAdc)  
C
.037  
.950  
---  
403  
RθJA  
°C/W  
TA = 25°C  
.037  
.950  
SMALL SIGNAL CHARACTERISTICS  
fT  
Current-Gain-Bandwidth Product  
100  
---  
MHz  
(VCE=5.0V, f=100MHz, IC=10mA)  
www.mccsemi.com  
1 of 3  
Revision: D  
2013/06/04  

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