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BC373RLRM PDF预览

BC373RLRM

更新时间: 2024-11-07 17:41:07
品牌 Logo 应用领域
安森美 - ONSEMI 放大器晶体管
页数 文件大小 规格书
4页 59K
描述
1000mA, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, TO-226AA, 3 PIN

BC373RLRM 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-92包装说明:CYLINDRICAL, O-PBCY-T3
针数:3Reach Compliance Code:compliant
HTS代码:8541.21.00.95风险等级:5.48
最大集电极电流 (IC):1 A配置:DARLINGTON
最小直流电流增益 (hFE):8000JEDEC-95代码:TO-92
JESD-30 代码:O-PBCY-T3JESD-609代码:e0
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:CYLINDRICAL
峰值回流温度(摄氏度):225极性/信道类型:NPN
认证状态:Not Qualified表面贴装:NO
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICON标称过渡频率 (fT):200 MHz
Base Number Matches:1

BC373RLRM 数据手册

 浏览型号BC373RLRM的Datasheet PDF文件第2页浏览型号BC373RLRM的Datasheet PDF文件第3页浏览型号BC373RLRM的Datasheet PDF文件第4页 
BC372, BC373  
High Voltage  
Darlington Transistors  
NPN Silicon  
http://onsemi.com  
Features  
Pb−Free Packages are Available*  
COLLECTOR 3  
BASE  
2
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
CollectorEmitter Voltage  
V
CEO  
Vdc  
EMITTER 1  
BC372  
BC373  
100  
80  
CollectorBase Voltage  
V
V
Vdc  
CES  
BC372  
BC373  
100  
80  
TO−92  
CASE 29  
STYLE 1  
Emitter−Base Voltage  
12  
Vdc  
Adc  
EBO  
Collector Current − Continuous  
I
C
1.0  
1
1
2
2
Total Power Dissipation @ T = 25°C  
P
625  
5.0  
mW  
mW/°C  
A
D
3
3
Derate above T = 25°C  
A
STRAIGHT LEAD  
BULK PACK  
BENT LEAD  
TAPE & REEL  
AMMO PACK  
Total Power Dissipation @ T = 25°C  
P
D
1.5  
12  
W
mW/°C  
A
Derate above T = 25°C  
A
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
MARKING DIAGRAM  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
200  
Unit  
°C/W  
°C/W  
BC  
37x  
Thermal Resistance, Junction−to−Ambient  
Thermal Resistance, Junction−to−Case  
R
q
JA  
JC  
AYWW G  
R
83.3  
q
G
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
x
= 2 or 3  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
BC372G  
Package  
Shipping  
TO−92  
(Pb−Free)  
5000 Units / Bulk  
BC373RL1  
TO−92  
2000 / Tape & Reel  
2000 / Tape & Reel  
BC373RL1G  
TO−92  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
March, 2007 − Rev. 4  
BC372/D  

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