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BC307BZL1G PDF预览

BC307BZL1G

更新时间: 2024-11-26 14:47:59
品牌 Logo 应用领域
安森美 - ONSEMI 放大器晶体管
页数 文件大小 规格书
4页 57K
描述
100mA, 45V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92, CASE 29-11, TO-226, 3 PIN

BC307BZL1G 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-92包装说明:CASE 29-11, TO-226, 3 PIN
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.21.00.75
风险等级:5.06其他特性:EUROPEAN PART NUMBER
最大集电极电流 (IC):0.1 A集电极-发射极最大电压:45 V
配置:SINGLE最小直流电流增益 (hFE):200
JEDEC-95代码:TO-92JESD-30 代码:O-PBCY-T3
JESD-609代码:e1元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:ROUND
封装形式:CYLINDRICAL峰值回流温度(摄氏度):260
极性/信道类型:PNP最大功率耗散 (Abs):1 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:BOTTOM
处于峰值回流温度下的最长时间:40晶体管应用:AMPLIFIER
晶体管元件材料:SILICON标称过渡频率 (fT):280 MHz
Base Number Matches:1

BC307BZL1G 数据手册

 浏览型号BC307BZL1G的Datasheet PDF文件第2页浏览型号BC307BZL1G的Datasheet PDF文件第3页浏览型号BC307BZL1G的Datasheet PDF文件第4页 
BC307B, BC307C  
Amplifier Transistors  
PNP Silicon  
Features  
Pb−Free Packages are Available*  
http://onsemi.com  
COLLECTOR  
1
MAXIMUM RATINGS  
2
BASE  
Rating  
Symbol  
Value  
−45  
Unit  
Vdc  
Collector − Emitter Voltage  
Collector − Base Voltage  
Emitter − Base Voltage  
Collector Current − Continuous  
Total Device Dissipation  
V
CEO  
V
CBO  
V
EBO  
−50  
Vdc  
3
EMITTER  
−5.0  
−100  
Vdc  
I
mAdc  
C
MARKING  
DIAGRAM  
P
P
D
D
@ T = 25°C  
Derate above 25°C  
350  
2.8  
mW  
mW/°C  
A
BC30  
Total Device Dissipation  
TO−92  
CASE 29  
STYLE 17  
7x  
AYWW G  
G
@ T = 25°C  
Derate above 25°C  
1.0  
8.0  
W
mW/°C  
C
1
2
3
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
BC307x = Device Code  
x = B or C  
A
= Assembly Location  
Y
= Year  
WW  
G
= Work Week  
= Pb−Free Package  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
(Note: Microdot may be in either location)  
Thermal Resistance,  
Junction−to−Ambient  
R
q
JA  
357  
°C/W  
ORDERING INFORMATION  
Thermal Resistance,  
Junction−to−Case  
R
q
JC  
125  
°C/W  
Device  
Package  
Shipping  
BC307B  
TO−92  
5000 Units / Box  
5000 Units / Box  
BC307BG  
TO−92  
(Pb−Free)  
BC307BRL1  
TO−92  
2000 / Tape & Reel  
2000 / Tape & Reel  
BC307BRL1G  
TO−92  
(Pb−Free)  
BC307BZL1  
TO−92  
2000 / Ammo Box  
2000 / Ammo Box  
BC307BZL1G  
TO−92  
(Pb−Free)  
BC307C  
TO−92  
5000 Units / Box  
5000 Units / Box  
BC307CG  
TO−92  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
September, 2005 − Rev. 3  
BC307/D  

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