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BAS16TT1_04 PDF预览

BAS16TT1_04

更新时间: 2024-10-02 03:06:47
品牌 Logo 应用领域
安森美 - ONSEMI 二极管开关
页数 文件大小 规格书
6页 64K
描述
Silicon Switching Diode

BAS16TT1_04 数据手册

 浏览型号BAS16TT1_04的Datasheet PDF文件第2页浏览型号BAS16TT1_04的Datasheet PDF文件第3页浏览型号BAS16TT1_04的Datasheet PDF文件第4页浏览型号BAS16TT1_04的Datasheet PDF文件第5页浏览型号BAS16TT1_04的Datasheet PDF文件第6页 
BAS16TT1  
Preferred Device  
Silicon Switching Diode  
Features  
Pb−Free Package is Available*  
http://onsemi.com  
MAXIMUM RATINGS (T = 25°C)  
A
3
1
Rating  
Symbol  
Max  
75  
Unit  
V
CATHODE  
ANODE  
Continuous Reverse Voltage  
Recurrent Peak Forward Current  
V
R
I
F
200  
500  
mA  
mA  
Peak Forward Surge Current  
I
FM(surge)  
Pulse Width = 10 ms  
THERMAL CHARACTERISTICS  
Characteristic  
3
CASE 463  
SOT−416  
STYLE 2  
Symbol  
Max  
Unit  
2
Total Device Dissipation,  
FR−4 Board (Note 1)  
P
D
1
225  
mW  
T = 25°C  
A
Derated above 25°C  
1.8  
mW/°C  
°C/W  
Thermal Resistance,  
R
555  
q
JA  
MARKING DIAGRAM  
Junction−to−Ambient (Note 1)  
Total Device Dissipation,  
FR−4 Board (Note 2)  
T = 25°C  
A
P
D
360  
mW  
A6  
Derated above 25°C  
2.9  
mW/°C  
°C/W  
Thermal Resistance,  
R
345  
q
JA  
Junction−to−Ambient (Note 2)  
Junction and Storage  
Temperature Range  
T , T  
−55 to  
+150  
°C  
J
stg  
ORDERING INFORMATION  
1. FR−4 @ Minimum Pad  
2. FR−4 @ 1.0 × 1.0 Inch Pad  
Device  
Package  
Shipping  
BAS16TT1  
SOT−416  
3000 / Tape & Reel  
3000 / Tape & Reel  
BAS16TT1G  
SOT−416  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy  
and soldering details, please download the  
ON Semiconductor Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
May, 2004 − Rev. 2  
BAS16TT1/D  
 

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