B220/A - B260/A
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
SPICE MODELS: B220 B230 B240 B250 B260
B220A B230A B240A B250A B260A
Features
·
·
Schottky Barrier Chip
Guard Ring Die Construction for
Transient Protection
Ideally Suited for Automatic Assembly
Low Power Loss, High Efficiency
Surge Overload Rating to 50A Peak
For Use in Low Voltage, High Frequency
Inverters, Free Wheeling, and Polarity
Protection Application
High Temperature Soldering:
260°C/10 Second at Terminal
Plastic Material - UL Flammability
Classification 94V-0
SMA
Min
SMB
Min
B
Dim
A
Max
2.92
4.60
1.63
0.31
5.59
0.20
1.52
2.62
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
·
·
·
·
2.29
4.00
1.27
0.15
4.80
0.10
0.76
2.01
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
B
A
J
C
D
C
D
E
·
·
G
H
J
G
H
E
All Dimensions in mm
Mechanical Data
No Suffix Designates SMB Package
“A” Suffix Designates SMA Package
·
Case: Molded Plastic
·
Terminals: Solder Plated Terminal - Solderable
per MIL-STD-202, Method 208
·
·
Polarity: Cathode Band or Cathode Notch
Approx. Weight: SMA 0.064 grams
SMB 0.093 grams
·
·
Mounting Position: Any
Marking: Type Number
@ TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
B220/A
20
B230/A
30
B240/A
B250/A
50
B260/A
60
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
40
V
VR(RMS)
IO
RMS Reverse Voltage
14
21
28
35
42
V
A
Average Rectified Output Current
@ TT = 100°C
2.0
Non-Repetitive Peak Forward Surge Current, 8.3ms single
half sine-wave superimposed on rated load
(JEDEC Method)
IFSM
50
A
Forward Voltage
@ IF = 2.0A
VFM
IRM
0.50
0.70
V
Peak Reverse Current
at Rated DC Blocking Voltage
@ TA = 25°C
@ TA = 100°C
0.5
20
mA
Cj
Typical Junction Capacitance (Note 2)
200
20
pF
K/W
K/W
°C
RqJT
Typical Thermal Resistance, Junction to Terminal
Typical Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
RqJA
25
Tj, TSTG
-65 to +150
Notes:
1. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
DS13004 Rev. E-2
1 of 2
B220/A-B260/A
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