B0540W
0.5A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
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Features
Mechanical Data
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Low Forward Voltage Drop
Guard Ring Construction for Transient Protection
High Conductance
Lead, Halogen and Antimony Free, RoHS Compliant (Note 1)
"Green" Device (Note 5)
Qualified to AEC-Q101 Standards for High Reliability
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Case: SOD-123
Case Material: Molded Plastic, “Green” Molding Compound
(Note 5). UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe) Solderable per MIL-STD-202, Method 208
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Polarity: Cathode Band
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.01 grams (approximate)
Top View
Maximum Ratings @T = 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Symbol
VRRM
VRWM
VR
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
40
V
RMS Reverse Voltage
Average Rectified Output Current (See Figure 4)
Non-Repetitive Peak Forward Surge Current
28
0.5
V
A
VR(RMS)
IO
5.5
A
IFSM
8.3ms single half sine-wave superimposed on rated load
Thermal Characteristics
Characteristic
Symbol
Typ
385
325
Max
⎯
⎯
Unit
Thermal Resistance Junction to Ambient Air (Note 2) TA = 25°C
Thermal Resistance Junction to Ambient Air (Note 3) TA = 25°C
Operating and Storage Temperature Range
°C/W
°C/W
°C
Rθ
Rθ
JA
JA
-65 to +150
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Symbol
Value
Unit
Test Conditions
Minimum Reverse Breakdown Voltage (Note 4)
40
V
V(BR)R
IR = 20μA
IF = 0.5A, TJ = 25°C
IF = 1.0A, TJ = 25°C
IF = 0.5A, TJ = 100°C
IF = 1.0A, TJ = 100°C
VR = 20V, TJ = 25°C
VR = 40V, TJ = 25°C
VR = 20V, TJ = 100°C
VR = 40V, TJ = 100°C
f = 1MHz, VR = 0V DC
0.510
0.620
0.460
0.610
Maximum Forward Voltage Drop
V
VFM
10
20
μA
Maximum Leakage Current (Note 4)
Total Capacitance
IRM
5.0
13
mA
pF
170
CT
Notes:
1. No purposefully added lead. Halogen and Antimony Free.
2. FR-4 PCB, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polymide PCB, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Short duration pulse test used to minimize self-heating effect.
5. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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www.diodes.com
March 2009
© Diodes Incorporated
B0540W
Document number: DS30138 Rev. 10 - 2