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B048T096T24 PDF预览

B048T096T24

更新时间: 2024-01-01 03:54:52
品牌 Logo 应用领域
VICOR 转换器模拟IC信号电路
页数 文件大小 规格书
12页 1287K
描述
BCM Bus Converter

B048T096T24 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:MODULE
包装说明:,针数:60
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.82Is Samacsys:N
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-XXMA-T60
JESD-609代码:e4湿度敏感等级:5
功能数量:1端子数量:60
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified最大供电电压 (Vsup):55 V
最小供电电压 (Vsup):38 V标称供电电压 (Vsup):48 V
表面贴装:NO温度等级:AUTOMOTIVE
端子面层:NICKEL PALLADIUM GOLD端子形式:THROUGH-HOLE
端子位置:UNSPECIFIED处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

B048T096T24 数据手册

 浏览型号B048T096T24的Datasheet PDF文件第6页浏览型号B048T096T24的Datasheet PDF文件第7页浏览型号B048T096T24的Datasheet PDF文件第8页浏览型号B048T096T24的Datasheet PDF文件第9页浏览型号B048T096T24的Datasheet PDF文件第11页浏览型号B048T096T24的Datasheet PDF文件第12页 
V•I Chip Bus Converter Module  
Application Note  
Parallel Operation  
The BCM will inherently current share when operated in an array. Arrays  
may be used for higher power or redundancy in an application.  
inductance exceeds 100 nH, the BCM input pins should be bypassed  
with an RC damper (e.g., 47 µF in series with 0.3 ohm) to retain low  
source impedance and stable operations. Given the wide bandwidth of  
the BCM, the source response is generally the limiting factor in the  
overall system response.  
Current sharing accuracy is maximized when the source and load  
impedance presented to each BCM within an array are equal. The  
recommended method to achieve matched impedances is to dedicate  
common copper planes within the PCB to deliver and return the current  
to the array, rather than rely upon traces of varying lengths. In typical  
applications the current being delivered to the load is larger than that  
sourced from the input, allowing traces to be utilized on the input side  
if necessary. The use of dedicated power planes is, however, preferable.  
Anomalies in the response of the source will appear at the output of  
the BCM multiplied by its K factor. The DC resistance of the source  
should be kept as low as possible to minimize voltage deviations. This is  
especially important if the BCM is operated near low or high line as the  
over/under voltage detection circuitry could be activated.  
The BCM power train and control architecture allow bi-directional  
power transfer, including reverse power processing from the BCM  
output to its input. Reverse power transfer is enabled if the BCM input  
is within its operating range and the BCM is otherwise enabled. The  
BCMs ability to process power in reverse improves the BCM transient  
response to an output load dump.  
Input Fuse Recommendations  
V•I Chips are not internally fused in order to provide flexibility in  
configuring power systems. However, input line fusing of V•I Chips  
must always be incorporated within the power system. A fast acting  
fuse should be placed in series with the +In port.  
Input Impedance Recommendations  
Application Notes  
To take full advantage of the BCM capabilities, the impedance  
presented to its input terminals must be low from DC to approximately  
5 MHz. The source should exhibit low inductance (less than 100 nH)  
and should have a critically damped response. If the interconnect  
For BCM and V•I Chip application notes on soldering, thermal  
management, board layout, and system design click on the link below:  
http://www.vicorpower.com/technical_library/application_information/chips/  
vicorpower.com  
800-735-6200  
V•I Chip Bus Converter Module  
B048F096T24  
Rev. 4.5  
Page 10 of 12  

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