是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | VFBGA, BGA100,10X10,25 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.A.2 | HTS代码: | 8542.31.00.01 |
Factory Lead Time: | 1 week | 风险等级: | 5.65 |
具有ADC: | YES | 地址总线宽度: | 24 |
位大小: | 32 | CPU系列: | CORTEX-M4 |
最大时钟频率: | 50 MHz | DAC 通道: | YES |
DMA 通道: | YES | 外部数据总线宽度: | 8 |
JESD-30 代码: | S-PBGA-B100 | 长度: | 7 mm |
I/O 线路数量: | 79 | 端子数量: | 100 |
片上程序ROM宽度: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA100,10X10,25 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 电源: | 1.2 V |
认证状态: | Not Qualified | RAM(字节): | 131072 |
ROM(单词): | 1048576 | ROM可编程性: | FLASH |
座面最大高度: | 1 mm | 速度: | 120 MHz |
子类别: | Microcontrollers | 最大供电电压: | 1.32 V |
最小供电电压: | 1.08 V | 标称供电电压: | 1.2 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 0.65 mm | 端子位置: | BOTTOM |
宽度: | 7 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
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