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ATSAM3U1EA-CU

更新时间： 2024-11-21 06:38:39
品牌 Logo 应用领域
爱特美尔 - ATMEL 微控制器和处理器外围集成电路异步传输模式ATM时钟
页数 文件大小 规格书
62页 1565K
描述
AT91ARM Cortex M3-based Microcontrollers

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中文翻译

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ATSAM3U1EA-CU 技术参数

是否Rohs认证：符合生命周期：Obsolete
零件包装代码：BGA包装说明：LFBGA, BGA144,12X12,32
针数：144Reach Compliance Code：unknown
ECCN代码：3A991.A.2HTS代码：8542.31.00.01
Factory Lead Time：1 week风险等级：5.73
Is Samacsys：N具有ADC：YES
地址总线宽度：24位大小：32
CPU系列：CORTEX-M3最大时钟频率：12 MHz
DAC 通道：YESDMA 通道：YES
外部数据总线宽度：8JESD-30 代码：S-PBGA-B144
长度：10 mmI/O 线路数量：96
端子数量：144最高工作温度：85 °C
最低工作温度：-40 °CPWM 通道：YES
封装主体材料：PLASTIC/EPOXY封装代码：LFBGA
封装等效代码：BGA144,12X12,32封装形状：SQUARE
封装形式：GRID ARRAY, LOW PROFILE, FINE PITCH电源：1.8,3.3 V
认证状态：Not QualifiedRAM（字节）：20480
ROM（单词）：65536ROM可编程性：FLASH
座面最大高度：1.4 mm速度：12 MHz
子类别：Microcontrollers最大供电电压：1.95 V
最小供电电压：1.62 V标称供电电压：1.8 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.8 mm端子位置：BOTTOM
宽度：10 mmuPs/uCs/外围集成电路类型：MICROCONTROLLER, RISC
Base Number Matches：1

ATSAM3U1EA-CU 数据手册

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Features  
• Core  
– ARM® Cortex®-M3 revision 2.0 running at up to 96 MHz  
– Memory Protection Unit (MPU)  
– Thumb®-2 instruction set  
• Memories  
– From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator,  
dual bank  
– From 16 to 48 Kbytes embedded SRAM with dual banks  
– 16 Kbytes ROM with embedded bootloader routines (UART, USB) and IAP routines  
– Static Memory Controller (SMC): SRAM, NOR, NAND support. NAND Flash  
controller with 4 Kbytes RAM buffer and ECC  
AT91ARM  
Cortex M3-based  
Microcontrollers  
• System  
– Embedded voltage regulator for single supply operation  
– POR, BOD and Watchdog for safe reset  
– Quartz or resonator oscillators: 3 to 20 MHz main and optional low power 32.768  
kHz for RTC or device clock.  
ATSAM3U Series  
Preliminary  
– High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz Default  
Frequency for fast device startup  
– Slow Clock Internal RC oscillator as permanent clock for device clock in low power  
mode  
– One PLL for device clock and one dedicated PLL for USB 2.0 High Speed Device  
– Up to 17 peripheral DMA (PDC) channels and 4-channel central DMA  
• Low Power Modes  
Summary  
– Sleep and Backup modes, down to 2.5 µA in Backup mode  
– Backup domain: VDDBU pin, RTC, 32 backup registers  
– Ultra low power RTC: 0.6 µA  
• Peripherals  
– USB 2.0 Device: 480 Mbps, 4-kbyte FIFO, up to 7 bidirectional Endpoints,  
dedicated DMA  
– Up to 4 USARTs (ISO7816, IrDA®, Flow Control, SPI, Manchester support) and one  
UART  
– Up to 2 TWI (I2C compatible), 1 SPI, 1 SSC (I2S), 1 HSMCI (SDIO/SD/MMC)  
– 3-Channel 16-bit Timer/Counter (TC) for capture, compare and PWM  
– 4-channel 16-bit PWM (PWMC)  
– 32-bit Real Time Timer (RTT) and RTC with calendar and alarm features  
– 8-channel 12-bit 1MSPS ADC with differential input mode and programmable gain  
stage, 8-channel 10-bit ADC  
• I/O  
– Up to 96 I/O lines with external interrupt capability (edge or level sensitivity),  
debouncing, glitch filtering and on-die Series Resistor Termination  
– Three 32-bit Parallel Input/Outputs (PIO)  
• Packages  
NOTE: This is a summary document.  
The complete document is available on  
the Atmel website at www.atmel.com.  
– 100-lead LQFP, 14 x 14 mm, pitch 0.5 mm  
– 100-ball LFBGA, 9 x 9 mm, pitch 0.8 mm  
– 144-lead LQFP, 20 x 20 mm, pitch 0.5 mm  
– 144-ball LFBGA, 10 x 10 mm, pitch 0.8 mm  
6430CS–ATARM–09-Apr-10  
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