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ATS-59003-C2-R0 PDF预览

ATS-59003-C2-R0

更新时间: 2024-11-08 06:38:39
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描述
Custom High Performance Cooling

ATS-59003-C2-R0 数据手册

  
Custom High Performance Cooling  
Solutions w/ maxiGRIP™ Attachment  
ATS PART # ATS-59003-C2-R0  
Features & Benefits  
D
C
»
»
Designed for flip-chip processors such as Freescale MPCs  
maxiGRIP™ attachment applies steady, even pressure to  
the component and does not require holes in the PCB  
»
Comes preassembled with high performance, phase  
changing, thermal interface material  
B
A
Thermal Performance  
*Image above is for illustration purposes only.  
AIR VELOCITY  
THERMAL RESISTANCE  
FT/MIN  
200  
M/S  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
°C/W (UNDUCTED FLOW)  
°C/W (DUCTED FLOW)  
2.4  
3.8  
3
300  
400  
2.6  
2.3  
2.1  
2
500  
600  
700  
800  
1.9  
Product Details  
INTERFACE MATERIAL  
SAINT-GOBAIN C1100F  
BLACK-ANODIZED  
DIMENSION A  
32 mm  
DIMENSION B  
DIMENSION C  
DIMENSION D  
FINISH  
50 mm  
12 mm  
71.3 mm  
NOTES:  
1)  
2)  
Dimension C = heat sink height from bottom of the base to the top of the fin field.  
ATS-59003-C1-R0 is a subsitute item available utilizing an equivalent phase change  
material (Chomerics T766).  
3)  
4)  
5)  
Thermal performance data are provided for reference only. Actual performance may vary  
by application.  
ATS reserves the right to update or change its products without notice to improve the  
design or performance.  
Contact ATS to learn about custom options available.  
For more information, to find a distributor or to place an order, visit www.qats.com or  
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).  
REV2_111708  

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