Datasheet > ATS-59006-C2-R0

ATS-59006-C2-R0

更新时间： 2024-11-08 06:38:39

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描述
Custom High Performance Cooling

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数据手册

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ATS-59006-C2-R0 数据手册

Custom High Performance Cooling

Solutions w/ maxiGRIP™ Attachment

ATS PART # ATS-59006-C2-R0

Features & Beneﬁts

Designed for flip-chip processors such as Freescale MPCs

maxiGRIP™ attachment applies steady, even pressure to

the component and does not require holes in the PCB

Comes preassembled with high performance, phase

changing, thermal interface material

Thermal Performance

*Image above is for illustration purposes only.

AIR VELOCITY

THERMAL RESISTANCE

FT/MIN

200

M/S

1.0

1.5

2.0

2.5

3.0

3.5

4.0

°C/W (UNDUCTED FLOW)

°C/W (DUCTED FLOW)

3.8

6.2

4.9

4.2

3.7

3.3

300

400

500

600

700

800

2.8

Product Details

INTERFACE MATERIAL

SAINT-GOBAIN C1100F

BLACK-ANODIZED

DIMENSION A

29 mm

DIMENSION B

DIMENSION C

DIMENSION D

FINISH

37 mm

11 mm

54 mm

NOTES:

Dimension C = heat sink height from bottom of the base to the top of the ﬁn ﬁeld.

ATS-59006-C1-R0 is a subsitute item available utilizing an equivalent phase change

material (Chomerics T766).

Thermal performance data are provided for reference only. Actual performance may vary

by application.

ATS reserves the right to update or change its products without notice to improve the

design or performance.

Contact ATS to learn about custom options available.

For more information, to ﬁnd a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

REV2_111408

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