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AT45DB161E PDF预览

AT45DB161E

更新时间: 2024-11-14 14:58:07
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
77页 1999K
描述
16Mbit, 2.3V to 3.6V Range SPI Serial Flash Memory

AT45DB161E 数据手册

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Datasheet  
AT45DB161E  
16-Mbit DataFlash (with Extra 512-kbits) 2.3 V or 2.5 V Minimum SPI Serial Flash Memory  
Features  
• Single 2.3 V - 3.6 V or 2.5 V - 3.6 V supply  
• Serial Peripheral Interface (SPI) compatible  
• Supports SPI modes 0 and 3  
• Supports RapidS™ operation  
• Continuous read capability through entire array  
• Up to 85 MHz  
• Low-power read option up to 15 MHz  
• Clock-to-output time (tV) of 6 ns maximum  
• User-configurable page size  
• 512 bytes per page  
• 528 bytes per page (default)  
• Page size can be factory pre-configured for 512 bytes  
• Two fully independent SRAM data buffers (512/528 bytes)  
• Allows receiving data while reprogramming the main memory array  
• Flexible programming options  
• Byte/Page Program (1 to 512/528 bytes) directly into main memory  
• Buffer Write  
• Buffer to Main Memory Page Program  
• Flexible erase options  
• Page Erase (512/528 bytes)  
• Block Erase (4 kB)  
• Sector Erase (128 kB)  
• Chip Erase (16 Mbits)  
• Program and Erase Suspend/Resume  
• Advanced hardware and software data protection features  
• Individual sector protection  
• Individual sector lockdown to make any sector permanently read-only  
• 128-byte, One-Time Programmable (OTP) Security Register  
• 64 bytes factory programmed with a unique identifier  
• 64 bytes user programmable  
• Hardware and software controlled reset options  
• JEDEC Standard Manufacturer and Device ID Read  
• Low-power dissipation  
• 400 nA Ultra-Deep Power-Down current (typical)  
• 5 µA Deep Power-Down current (typical)  
• 25 µA Standby current (typical)  
• 7 mA Active Read current (typical @ 15 MHz))  
• Endurance: 100,000 program/erase cycles per page minimum  
• Data retention: 20 years  
• Complies with full industrial temperature range  
• Green (Pb/Halide-free/RoHS compliant) packaging options  
• 8-lead SOIC (0.150" wide and 0.208" wide)  
• 8-pad Ultra-thin DFN (5 x 6 x 0.6mm)  
• 11-ball Wafer Level Chip Scale Package  
• Die in Wafer Form (contact factory for availability)  
DS-AT45DB161E-8782 Rev. P  
1/27/23  
Page 1  
© 2023 Renesas Electronics  

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