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AT45DB081E PDF预览

AT45DB081E

更新时间: 2024-11-30 14:58:19
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
97页 2100K
描述
8Mbit, 1.7 V to 3.6 V Range SPI Serial Flash Memory

AT45DB081E 数据手册

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Datasheet  
AT45DB081E  
8-Mbit DataFlash (with Extra 256 kbits), 1.7 V Minimum SPI Serial Flash Memory  
Features  
• Single 1.7 V - 3.6 V supply  
• Serial Peripheral Interface (SPI) compatible  
• Supports SPI modes 0 and 3  
• Supports RapidSoperation  
• Continuous read capability through entire array  
• Up to 85 MHz  
• Low-power read option up to 15 MHz  
• Clock-to-output time (tV) of 6 ns maximum  
• User configurable page size  
• 256 bytes per page  
• 264 bytes per page (default)  
• Page size can be factory pre-configured for 256 bytes  
• Two fully independent SRAM data buffers (256/264 bytes)  
• Allows receiving data while reprogramming the main memory array  
• Flexible programming options  
• Byte/Page Program (1 to 256/264 bytes) directly into main memory  
• Buffer Write  
• Buffer to Main Memory Page Program  
• Flexible erase options  
• Page Erase (256/264 bytes)  
• Block Erase (2 kB)  
• Sector Erase (64 kB)  
• Chip Erase (8 Mbits)  
• Program and Erase Suspend/Resume  
• Advanced hardware and software data protection features  
• Individual sector protection  
• Individual sector lockdown to make any sector permanently read-only  
• 128-byte, One-Time Programmable (OTP) Security Register  
• 64 bytes factory programmed with a unique identifier  
• 64 bytes user programmable  
• Hardware and software controlled reset options  
• JEDEC Standard Manufacturer and Device ID Read  
• Low power dissipation  
• 400 nA Ultra-Deep Power-Down current (typical)  
• 4.5 µA Deep Power-Down current (typical)  
• 25 µA Standby current (typical)  
• 11 mA Active Read current (typical at 20 MHz)  
• Endurance: 100,000 program/erase cycles per page minimum  
• Data retention: 20 years  
• Complies with full industrial temperature range  
• Green (Pb/Halide-free/RoHS compliant) packaging options  
• 8-lead SOIC (0.150" wide and 0.208" wide)  
• 8-pad Ultra-thin DFN (5 x 6 x 0.6 mm)  
• 8-ball (2 x4 array) Wafer Level Chip Scale Package  
• Die in Wafer Form  
DS-AT45DB081E-028 Rev. M  
8/16/22  
Page 1  
© 2022 Renesas Electronics  

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