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ASM2P2309NZF-16-ST PDF预览

ASM2P2309NZF-16-ST

更新时间: 2024-11-29 20:13:59
品牌 Logo 应用领域
PULSECORE 驱动光电二极管逻辑集成电路
页数 文件大小 规格书
9页 399K
描述
Low Skew Clock Driver, 2309 Series, 9 True Output(s), 0 Inverted Output(s), PDSO16, 0.150 INCH, ROHS COMPLIANT, SOIC-16

ASM2P2309NZF-16-ST 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:0.150 INCH, ROHS COMPLIANT, SOIC-16Reach Compliance Code:unknown
风险等级:5.67系列:2309
输入调节:STANDARDJESD-30 代码:R-PDSO-G16
长度:9.905 mm逻辑集成电路类型:LOW SKEW CLOCK DRIVER
功能数量:1反相输出次数:
端子数量:16实输出次数:9
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED传播延迟(tpd):9.2 ns
认证状态:Not QualifiedSame Edge Skew-Max(tskwd):0.25 ns
座面最大高度:1.75 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES温度等级:COMMERCIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mm最小 fmax:133.33 MHz
Base Number Matches:1

ASM2P2309NZF-16-ST 数据手册

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June 2005  
rev 0.2  
ASM2P2309NZ  
Nine Output 3.3V Buffer  
Features  
Functional Description  
One-input to Nine-Output Buffer/Driver  
The ASM2P2309NZ is a low-cost buffer designed to  
distribute high-speed clocks in mobile PC systems and  
desktop PC systems with SDRAM support. The part has  
nine outputs, eight of which can be used to drive two  
DIMMs or four SO-DIMMs, and the remaining can be used  
for external feedback to a PLL. The device operates at  
3.3V and outputs can run up to 133.33MHz.  
Supports two DIMMs or four SO-DIMMs with one  
additional output for feedback to an external or  
chipset PLL  
Low power consumption for mobile applications  
Less than 32mA at 66.6MHz with unloaded  
outputs  
1nS Input-Output delay  
Buffers all frequencies from DC to 133.33MHz  
Output-output skew less than 250pS  
Multiple VDD and VSS pins for noise and  
electromagnetic interference (EMI) reduction  
Space-saving 16-pin 150-mil SOIC Package  
3.3V operation  
The ASM2P2309NZ is designed for low EMI and power  
optimization. It has multiple VSS and VDD pins for noise  
optimization and consumes less than 32mA at 66.6MHz,  
making it ideal for the low-power requirements of mobile  
systems. It is available in an ultra-compact 150-mil 16-pin  
SOIC Package.  
Commercial and Industrial temperature parts are  
available  
Block Diagram  
BUF_IN  
OUTPUT1  
OUTPUT2  
OUTPUT3  
OUTPUT4  
OUTPUT5  
OUTPUT6  
OUTPUT7  
OUTPUT8  
OUTPUT9  
Alliance Semiconductor  
2575 Augustine Drive Santa Clara, CA Tel: 408.855.4900 Fax: 408.855.4999 www.alsc.com  
Notice: The information in this document is subject to change without notice.  

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