5秒后页面跳转
AS7C33256PFS32A-166TQIN PDF预览

AS7C33256PFS32A-166TQIN

更新时间: 2024-02-06 19:44:35
品牌 Logo 应用领域
ALSC 存储内存集成电路静态存储器
页数 文件大小 规格书
20页 528K
描述
3.3V 256K x 32/36 pipelined burst synchronous SRAM

AS7C33256PFS32A-166TQIN 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:QFP包装说明:LQFP,
针数:100Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.35最长访问时间:9 ns
其他特性:FLOW-THROUGH OR PIPELINED ARCHITECTUREJESD-30 代码:R-PQFP-G100
JESD-609代码:e3长度:20 mm
内存密度:8388608 bit内存集成电路类型:STANDARD SRAM
内存宽度:32功能数量:1
端子数量:100字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX32封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):245认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:14 mmBase Number Matches:1

AS7C33256PFS32A-166TQIN 数据手册

 浏览型号AS7C33256PFS32A-166TQIN的Datasheet PDF文件第2页浏览型号AS7C33256PFS32A-166TQIN的Datasheet PDF文件第3页浏览型号AS7C33256PFS32A-166TQIN的Datasheet PDF文件第4页浏览型号AS7C33256PFS32A-166TQIN的Datasheet PDF文件第6页浏览型号AS7C33256PFS32A-166TQIN的Datasheet PDF文件第7页浏览型号AS7C33256PFS32A-166TQIN的Datasheet PDF文件第8页 
AS7C33256PFS32A  
AS7C33256PFS36A  
®
Signal descriptions  
Signal  
I/O Properties Description  
CLK  
I
I
CLOCK  
SYNC  
SYNC  
Clock. All inputs except OE, ZZ, LBO are synchronous to this clock.  
Address. Sampled when all chip enables are active and ADSC or ADSP are asserted.  
Data. Driven as output when the chip is enabled and OE is active.  
A, A0, A1  
DQ[a,b,c,d] I/O  
Master chip enable. Sampled on clock edges when ADSP or ADSC is active. When CE0  
is inactive, ADSP is blocked. Refer to the Synchronous Truth Table for more  
information.  
CE0  
I
SYNC  
Synchronous chip enables. Active HIGH and active LOW, respectively. Sampled on  
clock edges when ADSC is active or when CE0 and ADSP are active.  
CE1, CE2  
ADSP  
I
I
SYNC  
SYNC  
Address strobe processor. Asserted LOW to load a new bus address or to enter standby  
mode.  
Address strobe controller. Asserted LOW to load a new address or to enter standby  
mode.  
ADSC  
ADV  
GWE  
I
I
I
SYNC  
SYNC  
SYNC  
Advance. Asserted LOW to continue burst read/write.  
Global write enable. Asserted LOW to write all 32/36 bits. When HIGH, BWE and  
BW[a:d] control write enable.  
Byte write enable. Asserted LOW with GWE = HIGH to enable effect of BW[a:d]  
inputs.  
BWE  
I
SYNC  
SYNC  
Write enables. Used to control write of individual bytes when GWE = HIGH and BWE =  
LOW. If any of BW[a:d] is active with GWE = HIGH and BWE = LOW the cycle is a  
write cycle. If all BW[a:d] are inactive the cycle is a read cycle.  
BW[a,b,c,d] I  
Asynchronous output enable. I/O pins are driven when OE is active and the chip is in  
read mode.  
OE  
I
I
ASYNC  
STATIC  
Selects Burst mode. When tied to V or left floating, device follows Interleaved Burst  
DD  
LBO  
order. When driven Low, device follows linear Burst order. This signal is internally  
pulled High.  
ZZ  
I
-
ASYNC  
-
Snooze. Places device in LOW power mode; data is retained. Connect to GND if unused.  
No connect  
NC  
Snooze Mode  
SNOOZE MODE is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of  
SNOOZE MODE is dictated by the length of time the ZZ is in a High state.  
The ZZ pin is an asynchronous, active high input that causes the device to enter SNOOZE MODE.  
When the ZZ pin becomes a logic High, ISB2 is guaranteed after the time tZZI is met. After entering SNOOZE MODE, all inputs except ZZ  
is disabled and all outputs go to High-Z. Any operation pending when entering SNOOZE MODE is not guaranteed to successfully complete.  
Therefore, SNOOZE MODE (READ or WRITE) must not be initiated until valid pending operations are completed. Similarly, when exiting  
SNOOZE MODE during tPUS, only a DESELECT or READ cycle should be given while the SRAM is transitioning out of SNOOZE MODE.  
11/30/04, v.3.1  
Alliance Semiconductor  
P. 5 of 20  

与AS7C33256PFS32A-166TQIN相关器件

型号 品牌 描述 获取价格 数据表
AS7C33256PFS32A2-100BC ISSI SRAM

获取价格

AS7C33256PFS32A2-100TQC ISSI Standard SRAM, 256KX32, 12ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100

获取价格

AS7C33256PFS32A2-100TQI ISSI Standard SRAM, 256KX32, 12ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100

获取价格

AS7C33256PFS32A2-133BC ISSI SRAM

获取价格

AS7C33256PFS32A2-133BI ISSI SRAM

获取价格

AS7C33256PFS32A2-133TQC ISSI Standard SRAM, 256KX32, 10ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100

获取价格