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AS7C33256PFS36A-133BC PDF预览

AS7C33256PFS36A-133BC

更新时间: 2024-02-17 07:59:41
品牌 Logo 应用领域
ALSC 静态存储器内存集成电路
页数 文件大小 规格书
14页 373K
描述
Standard SRAM, 256KX36, 10ns, CMOS, PBGA119, 14 X 20 MM, BGA-119

AS7C33256PFS36A-133BC 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:BGA包装说明:LBGA, BGA119,7X17,50
针数:119Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.63最长访问时间:10 ns
其他特性:FLOW-THROUGH OR PIPELINED ARCHITECTUREI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
长度:22 mm内存密度:9437184 bit
内存集成电路类型:STANDARD SRAM内存宽度:36
功能数量:1端子数量:119
字数:262144 words字数代码:256000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:256KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA119,7X17,50
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5/3.3,3.3 V认证状态:Not Qualified
座面最大高度:1.7 mm最大待机电流:0.03 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.425 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

AS7C33256PFS36A-133BC 数据手册

 浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第2页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第3页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第4页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第5页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第6页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第7页 
March 2002  
AS7C33256PFS32A  
AS7C33256PFS36A  
®
3.3V 256K × 32/36 pipeline burst synchronous SRAM  
Features  
• Organization: 262,144 words x 32 or 36 bits  
• Fast clock speeds to 166 MHz in LVTTL/LVCMOS  
• Fast clock to data access: 3.5/3.8/4.0/5.0 ns  
• Fast OE access time: 3.5/3.8/4.0/5.0 ns  
• Fully synchronous register-to-register operation  
• Single register “Flow-through” option  
• Single-cycle deselect  
- Dual-cycle deselect also available (AS7C33256PFD32A/  
AS7C33256PFD36A)  
• Pentium®1compatible architecture and timing  
• Asynchronous output enable control  
• Available in100-pin TQFP and 119-pin BGA packages  
• Byte write enables  
• 3.3V core power supply  
• 2.5V or 3.3V I/O operation with separate VDDQ  
• 30 mW typical standby power in power down mode  
• NTD™1 pipeline architecture available  
(AS7C33256NTD32A/ AS7C33256NTD36A)  
• Available in both 2 chip enable and 3 chip enable  
- 2 CE part number is AS7C33256PFS32A2 or AS7C33256PFS36A2  
®
1 Pentium is a registered trademark of Intel Corporation. NTD™ is a  
trademark of Alliance Semiconductor Corporation. All trademarks  
mentioned in this document are the property of their respective  
owners.  
Logic block diagram  
LBO  
Burst logic  
CLK  
ADV  
ADSC  
CLK  
CE  
CLR  
256K × 32/36  
Memory  
ADSP  
18  
16  
18  
18  
array  
D
CE  
CLK  
Q
A[17:0]  
Address  
register  
36/32  
36/32  
BWE  
GWE  
d
D
Q
Q
Q
Q
DQ  
d
Byte write  
BW  
registers  
CLK  
D
DQ  
c
BW  
c
Byte write  
registers  
CLK  
D
DQ  
b
BW  
b
Byte write  
registers  
CLK  
D
DQ  
a
4
BW  
a
Byte write  
registers  
CLK  
D
CE0  
CE1  
CE2  
OE  
Output  
registers  
CLK  
Q
Q
Input  
registers  
CLK  
Enable  
register  
CE  
CLK  
D
Enable  
delay  
Power  
down  
ZZ  
register  
CLK  
36/32  
DQ[a:d]  
OE  
FT  
Selection guide  
–166  
–150  
–133  
7.5  
133  
4
–100  
10  
Units  
ns  
Minimum cycle time  
6
6.6  
150  
3.8  
450  
110  
30  
Maximum pipelined clock frequency  
166  
3.5  
475  
130  
30  
100  
5
MHz  
ns  
Maximum pipelined clock access time  
Maximum operating current  
425  
100  
30  
325  
90  
mA  
mA  
mA  
Maximum standby current  
Maximum CMOS standby current (DC)  
30  
3/25/02; v.1.8  
Alliance Semiconductor  
P. 1 of 14  
Copyright ©Alliance Semiconductor. All rights reserved.  

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