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AS4SD16M16DGCR/IT PDF预览

AS4SD16M16DGCR/IT

更新时间: 2024-01-23 16:52:08
品牌 Logo 应用领域
MICROSS 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
2页 1114K
描述
Synchronous DRAM, 16MX16, CMOS, PDSO54, ROHS COMPLIANT, TSOP2-54

AS4SD16M16DGCR/IT 技术参数

生命周期:Active零件包装代码:TSOP2
包装说明:TSOP2,针数:54
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.68
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G54
JESD-609代码:e4长度:22.22 mm
内存密度:268435456 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:16功能数量:1
端口数量:1端子数量:54
字数:16777216 words字数代码:16000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:16MX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
认证状态:Not Qualified座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:NICKEL PALLADIUM GOLD
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL宽度:10.16 mm
Base Number Matches:1

AS4SD16M16DGCR/IT 数据手册

 浏览型号AS4SD16M16DGCR/IT的Datasheet PDF文件第2页 
-Formerly Austin Semiconductor, Inc.  
Copper Lead Frame  
54-Pin TSOPII  
SDRAM Products  
FEATURES  
BENEFITS  
• Clock frequency: up to 133 MHz  
• Enhanced Long-term reliability with copper  
lead frames  
• Configurations: 32Mx16, 16Mx16, 8Mx16 & 4Mx16  
• Superior thermal conductivity improvement:  
170 W/m*K vs. 14 W/m*K (a 12X difference)  
• Fully synchronous; all signals referenced to a  
positive clock edge  
• Internal pipelined operation; column address can be  
changed every clock cycle  
θ ja and jc characteristics provide up to 3X  
advantage of heat dissipation capability  
versus parts with alloy 42 lead frames  
• Internal banks for hiding row access/precharge  
• Power supply: +3.3V +/-0.3V  
• Heat dissipated from the die faster makes it  
run cooler, leading to longer life  
• LVTTL interface  
• Solder joint reliability vastly improved.  
- CTE of Copper (17 ppm/ oC), matches the  
CTE of Typical FR4 PWBs (15-17 ppm/ oC),  
whereas CTE of Alloy 42 (5 ppm/ oC),  
is a mismatch  
• Programmable burst length (1, 2, 4, 8, full page)  
• Programmable burst sequence: Sequential/Interleave  
• Auto Refresh (CBR)  
• Self Refresh Mode (/IT)  
64ms, 8,192 cycle refresh (/IT)  
<24ms, 8,192 cycle refresh (/XT)  
• RoHS Version (NiPdAu plating)  
- Most preferred for elimination of risk for  
whisker growth  
• Write recovery (tWR = “2 CLK”)  
• Random column address every clock cycle  
• Programmable CAS latency (2, 3 clocks)  
• Over broader Military and Industrial  
temperature ranges, the above benefits are  
even more important  
• Burst read/write and burst read/single write  
operations capability  
• Burst termination by burst stop and precharge command  
APPLICATIONS  
Examples Include:  
• Available in 54-pin TSOP-II, choice of lead frame:  
- Copper lead frame  
- Alloy 42 lead frame  
• Military, Aerospace, Avionics  
• Operating Temperature Range:  
Industrial: -40oC to +85oC  
• Cellular Base Stations  
• Gas / Oil Exploration  
• Engine Control  
Military:  
-55oC to +125oC  
• Pb/Sn finish or RoHS available  
• On-Board Flight Computers  
• Radar / Sonar  
• 100% product screened at temperature extremes & Vcc  
extremes  
www.micross.com  

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