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AS4C16M16MD1-6BCN PDF预览

AS4C16M16MD1-6BCN

更新时间: 2024-01-30 10:21:25
品牌 Logo 应用领域
ALSC 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
55页 6130K
描述
Programmable output buffer driver strength

AS4C16M16MD1-6BCN 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:TFBGA,Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.24
Factory Lead Time:8 weeks风险等级:1.69
访问模式:FOUR BANK PAGE BURST最长访问时间:5 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PBGA-B60
长度:9 mm内存密度:268435456 bit
内存集成电路类型:DDR DRAM内存宽度:16
湿度敏感等级:3功能数量:1
端口数量:1端子数量:60
字数:16777216 words字数代码:16000000
工作模式:SYNCHRONOUS组织:16MX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:1.025 mm
自我刷新:YES最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V表面贴装:YES
技术:CMOS端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:8 mm
Base Number Matches:1

AS4C16M16MD1-6BCN 数据手册

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A
S4C16M16MD1  
256Mb MOBILE DDR SDRAM  
8.1 Absolute Maximum Ratings ..........................................................................................................43  
8.2 Input/Output Capacitance .............................................................................................................43  
8.3 Electrical Characteristics and AC/DC Operating Conditions........................................................44  
8.3.1 Electrical Characteristics and AC/DC Operating Conditions...............................................................44  
8.4 IDD Specification Parameters and Test Conditions .....................................................................45  
8.4.1 IDD Specification Parameters and Test Conditions............................................................................45  
8.5 AC Timings....................................................................................................................................47  
8.5.2 Output Slew Rate Characteristics .......................................................................................................51  
7.5.3 AC Overshoot/Undershoot Specification.............................................................................................51  
8.5.4 AC Overshoot and Undershoot Definition...........................................................................................52  
9. PACKAGE DIMENSION..................................................................................................... 53  
10. ORDERING INFORMATION............................................................................................. 54  
11. REVISION HISTORY........................................................................................................ 55  
Mar, 28, 2013  
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