是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | FLANGE MOUNT, R-XUFM-X10 | 针数: | 25 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
风险等级: | 5.63 | Is Samacsys: | N |
外壳连接: | ISOLATED | 最大集电极电流 (IC): | 140 A |
集电极-发射极最大电压: | 1200 V | 配置: | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR |
门极-发射极最大电压: | 20 V | JESD-30 代码: | R-XUFM-X10 |
元件数量: | 2 | 端子数量: | 10 |
最高工作温度: | 150 °C | 封装主体材料: | UNSPECIFIED |
封装形状: | RECTANGULAR | 封装形式: | FLANGE MOUNT |
峰值回流温度(摄氏度): | NOT SPECIFIED | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 595 W | 认证状态: | Not Qualified |
子类别: | Insulated Gate BIP Transistors | 表面贴装: | NO |
端子形式: | UNSPECIFIED | 端子位置: | UPPER |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 晶体管应用: | POWER CONTROL |
晶体管元件材料: | SILICON | 标称断开时间 (toff): | 610 ns |
标称接通时间 (ton): | 340 ns | VCEsat-Max: | 2.1 V |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
APTGT100A120T3AG-Module | MICROCHIP |
获取价格 |
Configuration: Phase legVCES (V): 1200VCESat (V): 1.7Current (A) Tc=80C: 100Silicon type: | |
APTGT100A120TG | MICROSEMI |
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Phase leg Fast Trench + Field Stop IGBT Power Module | |
APTGT100A120TG-Module | MICROCHIP |
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Configuration: Phase legVCES (V): 1200VCESat (V): 1.7Current (A) Tc=80C: 100Silicon type: | |
APTGT100A170D1 | ADPOW |
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Phase leg Trench IGBT Power Module | |
APTGT100A170T | ADPOW |
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Phase leg Trench + Field Stop IGBT Power Module | |
APTGT100A170TG | MICROSEMI |
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Phase leg Trench + Field Stop IGBT Power Module | |
APTGT100A170TG-Module | MICROCHIP |
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Configuration: Phase legVCES (V): 1700VCESat (V): 2Current (A) Tc=80C: 100Silicon type: TR | |
APTGT100A60T | ADPOW |
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Phase leg Trench + Field Stop IGBT Power Module | |
APTGT100A60T1G | MICROSEMI |
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Phase leg Trench + Field Stop IGBT® Power Mod | |
APTGT100A60T1G-Module | MICROCHIP |
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Configuration: Phase legVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 100Silicon type: T |