APT6040BVFR
APT6040SVFR
APT6040BVFRG APT6040SVFRG
600V 15A 0.45 Ω
*G Denotes RoHS Compliant, Pb Free Terminal Finish.
BVFR
POWER MOS V® FREDFET
Power MOS V® is a new generation of high voltage N-Channel enhance-
ment mode power MOSFETs. This new technology minimizes the JFET ef-
fect, increases packing density and reduces the on-resistance. Power MOS
D3PAK
V® also achieves faster switching speeds through optimized gate layout.
SVFR
• Faster Switching
• Lower Leakage
• Avalanche Energy Rated
D
•
FAST RECOVERY BODY DIODE
G
• TO-247 or Surface Mount D3PAK Package
S
MAXIMUM RATINGS
Symbol Parameter
All Ratings: T = 25°C unless otherwise specified.
C
APT6040B_SVFR(G)
UNIT
VDSS
ID
Drain-Source Voltage
Volts
600
15
Continuous Drain Current @ TC = 25°C
Amps
Volts
1
IDM
60
Pulsed Drain Current
VGS
VGSM
Gate-Source Voltage Continuous
Gate-Source Voltage Transient
±30
±40
250
2.0
Watts
W/°C
Total Power Dissipation @ TC = 25°C
Linear Derating Factor
PD
TJ,TSTG Operating and Storage Junction Temperature Range
-55 to 150
300
15
°C
Amps
mJ
TL
Lead Temperature: 0.063" from Case for 10 Sec.
1
IAR
Avalanche Current
(Repetitive and Non-Repetitive)
1
EAR
EAS
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
30
4
960
STATIC ELECTRICAL CHARACTERISTICS
Symbol Characteristic / Test Conditions
UNIT
Volts
MIN
TYP
MAX
BVDSS
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250μA)
600
2
RDS(on)
Drain-Source On-State Resistance
(VGS = 10V, ID = 7.5A)
Ohms
0.45
250
1000
±100
4
Zero Gate Voltage Drain Current (VDS = 600V, VGS = 0V)
Zero Gate Voltage Drain Current (VDS = 480V, VGS = 0V, TC = 125°C)
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)
Gate Threshold Voltage (VDS = VGS, ID = 1mA)
IDSS
μA
nA
IGSS
Volts
VGS(th)
2
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
Microsemi Website - http://www.microsemi.com