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AN1071

更新时间： 2024-10-28 22:05:43

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Information About the LM2650 Evaluation Board

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AN1071 数据手册

National Semiconductor

AN-1071

Steven Hunt

Information About the

LM2650 Evaluation Board

Rev. 1

September 1997

INTRODUCTION

For convenience, a sample of the LM2650 and eight other

components have been assembled: a 0.1 µF capacitor at

each of C1, C2, C6, and CB, a 0.2 µF capacitor at CVDD, a

0.01 µF capacitor at CSS, a 24.9 kΩ resistor at R2, and a 0Ω

resistor at R4. Of the eight, the first seven are common to

many applications, and the last is simply a jumper grounding

the SYNC input. When the synchronization feature is not be-

ing used, the SYNC input should be grounded.

A printed circuit board (PCB) has been developed. This ap-

plication note contains information about the board.

GENERAL DESCRIPTION

The LM2650 evaluation board is provided as a tool for devel-

oping DC/DC converters based on the LM2650 IC. It is con-

figured for single-output, step-down DC/DC converters. Fig-

ure 1 is a complete schematic of the board which can

accommodate up to 28 components including the LM2650.

Table 1 is a complete list of pads for placing components.

EXAMPLE CIRCUITS

The components contained in Tables 2, 3, and 4 can be used

to build typical application circuits. As with the design of any

DC/DC converter, the design of these involved tradeoffs be-

tween efficiency, size, and cost. The converters detailed in

Table 2 were designed with efficiency as the number one cri-

teria. Those detailed in Table 4 trade slightly higher switching

losses for a much smaller inductor.

Note: Not all applications will require the placement of all 28

components. The number of components placed depends

on the requirements of the application and the use of fea-

tures like programmable soft-start. The LM2650 evaluation

board is intended to be a reusable tool on which many differ-

ent converters meeting the requirements of many different

applications can be built. It is not intended to demonstrate

only one application of the LM2650.

AN100011-5

FIGURE 1. The LM2650 Evaluation Board Rev. 1 Schematic

THERMAL PERFORMANCE

2.0W respectively. These measurements were made in still

air. The junction-to-ambient thermal resistance of the pack-

aged IC alone in still air is 78˚C/W. The board is 0.063″ thick

FR-4 material.

The 24-lead SO package is a molded plastic package with a

solid copper lead frame. Most of the heat generated at the

die flows through the lead frame into the 3-ounce copper

planes on the board. The board then acts as a heat sink. The

junction-to-ambient thermal resistance of the packaged IC

mounted on the board has been measured to be 38˚C/W, 37

˚C/W, and 35 ˚C/W for the dissipation of 1.0W, 1.5W, and

ART

Figure 2 through Figure 4 show the PCB art work.

AN100011

www.national.com

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