Datasheet > AN10778

AN10778

更新时间： 2024-10-29 08:30:43

品牌	Logo	应用领域
恩智浦 - NXP		微控制器 PC
页数	文件大小	规格书
14页	255K
描述
PCB layout guidelines for NXP MCUs in BGA packages

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AN10778 数据手册

AN10778

PCB layout guidelines for NXP MCUs in BGA packages

Rev. 2 — 15 April 2011

Application note

Document information

Info

Content

Keywords

LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x,

LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,

LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478,

LPC2880, LPC2888, LPC3130, LPC3131, LPC3141, LPC3143,

LPC3152, LPC3154, LPC3180/01, LPC3220, LPC3230, LPC3240,

LPC3250, LH79524, LH7A400, LH7A404, TFBGA100, TFBGA144,

TFBGA208, TFBGA180, TFBGA296, LFBGA208, BGA256, LBGA256,

LFBGA256, LFBGA324, LFBGA320, Layout Guidelines, BGA, PCB, Fan-

out

Abstract

This application note is focused on Printed Circuit Board (PCB) layout

issues when using (L)(LF)(TF)BGA packages from the NXP LPC

Microcontroller family.

12 3 4 5 6 7...14

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