Datasheet > AN-5026

AN-5026

更新时间： 2024-11-13 22:05:43

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飞兆/仙童 - FAIRCHILD		/
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Using BGA Packages

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Fairchild Semiconductor

Application Note

AN-5026

January 2001

Revised September 2001

Using BGA Packages

TABLE 1. BGA Space Savings

Compared to Surface Mount Packages

Introduction

Demanding space and weight requirements of personal

computing and portable electronic equipment has led to

many innovations in IC packaging. Combining the right

interface and logic products with new package technology

can have a significant impact on the capabilities and form-

factor of the end product. Leaded surface mount devices

are constantly pushing the manufacturing capabilities of

leading board manufacturers to finer and finer lead pitch

geometry’s to increase I/O density and reduce board

space.

Number

of Bits

QVSOP

TSSOP

> 66%

> 67%

65.50%

61%

TVSOP

> 47%

61%

BQSOP

> 59%

49%

36 to 48

32 to 40

18 to 24

16 to 20

40%

39%

37%

This requirement has lead to significant interest in the

JEDEC (Joint Electron Device Engineering Council) regis-

tered Fine-Pitch Ball Grid Array (FBGA) package. These

packages are ideally suited to low cost, high volume appli-

cations, where package size and performance is of major

importance. Typical BGA applications include:

1. Notebook computers

2. Personal Digital Assistants (PDA’s)

3. Mobile telephone handsets

4. High density disk drives

5. Camcorders

6. Digital cameras

BGA advantages compared to fine pitch QFP or TSSOP

packages:

1. BGAs are usually smaller.

2. BGAs have larger pitch.

3. BGAs have no fragile leads, that causes yield and

rework problems.

4. Board assembly yields are significantly improved.

5. Board inspection can be reduced.

6. BGAs have better thermal and electrical properties.

7. In many applications, the use of BGA results in signifi-

cant system level cost savings.

FIGURE 1. 114 Ball BGA vs. Surface Mount

Surface Mount vs. BGA

At 0.4 to 0.5mm pin pitch, the race to finer surface mount

lead pitches has hit several technical and economic walls.

Manufacturing anything smaller will significantly impact

PCB yield and push board costs above acceptable levels

for the highly competitive and cost conscious electronics

industry. Avoiding problems such as bent leads and solder

bridging become significant manufacturing challenges.

Additionally, electrical problems such as crosstalk become

a major issue due to the length and close pitch of the leads

on surface mount packages.

Alternatively, BGA packaging uses relatively wide “pad to

pad” pitch rules and when coupled with existing PCB man-

ufacturing processes result in high yields. The “array”

approach improves I/O density and reduces the board

space consumed by the device. Table 1 and Figure 1 show

examples of space savings of BGA over surface mount

packages.

AN500543

www.fairchildsemi.com

12 3 4 5 6 7 8

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