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AM29DL164DB120WCK PDF预览

AM29DL164DB120WCK

更新时间: 2024-10-29 03:13:27
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路存储闪存
页数 文件大小 规格书
52页 986K
描述
Flash, 1MX16, 120ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48

AM29DL164DB120WCK 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:TFBGA,
针数:48Reach Compliance Code:compliant
ECCN代码:3A001.A.2.CHTS代码:8542.32.00.51
风险等级:5.84最长访问时间:120 ns
其他特性:20 YEAR DATA RETENTION备用内存宽度:8
启动块:BOTTOM数据保留时间-最小值:20
JESD-30 代码:R-PBGA-B48JESD-609代码:e1
长度:9 mm内存密度:16777216 bit
内存集成电路类型:FLASH内存宽度:16
湿度敏感等级:3功能数量:1
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:1MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):260编程电压:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40类型:NOR TYPE
宽度:8 mm

AM29DL164DB120WCK 数据手册

 浏览型号AM29DL164DB120WCK的Datasheet PDF文件第46页浏览型号AM29DL164DB120WCK的Datasheet PDF文件第47页浏览型号AM29DL164DB120WCK的Datasheet PDF文件第48页浏览型号AM29DL164DB120WCK的Datasheet PDF文件第49页浏览型号AM29DL164DB120WCK的Datasheet PDF文件第50页浏览型号AM29DL164DB120WCK的Datasheet PDF文件第51页 
Deleted references to the 56-pin SSOP and the corre-  
sponding 70R speed option.  
Revision D (February 22, 2000)  
Global  
Ordering Information  
The Am29DL16x family has migrated to a new 0.23  
µm process technology, which is indicated by a “D” in  
the ordering part number. All references in this docu-  
ment have been changed to reflect the new process.  
Added valid combinations for the Am29DL164D device  
in TSOP. Added valid combinations for the  
Am29DL162D devices in TSOP and FBGA packages.  
Deleted valid combinations for the 80 ns  
Am29DL164D device in FBGA package.  
Distinctive Characteristics  
Under “Performance Characteristics,” the typical ac-  
celerated programming time was changed to match  
the AC tables.  
Device Bus Operations  
Table 3, Sector Addresses for Top Boot Sector De-  
vices: In note below table, corrected last device part  
number to top boot.  
AC Characteristics  
Figure 17, Program Operations Timing; Figure 19,  
Chip/Sector Erase Operations: Deleted tGHWL and  
changed OE# waveform to start at high.  
Table 7, Autoselect Codes: The SecSi Sector Indicator  
Bit values have changed from 80h and 00h to 81h and  
01h, respectively.  
Erase and Program Operations table; Alternate CE#  
Controlled Erase and Program Operations table:  
Changed the typical and maximum specifications for  
programming time.  
Command Definitions  
Table 14, Command Definitions: The SecSi Sector In-  
dicator Bit values have changed from 80h and 00h to  
81h and 01h, respectively.  
Erase and Programming Performance  
AC Characteristics  
In the table, changed the typical and maximum specifi-  
cations for programming time. The typical and maxi-  
mum chip programming times in both byte and word  
modes are reduced.  
Read-only Operations table: Changed parameter tDF to  
16 ns for all speed options. Added Note 3.  
Revision D+2 (September 4, 2000)  
Physical Dimensions  
Deleted remaining references to 80 ns speed option,  
which was officially removed in Revision D+1. Cor-  
rected references to Am29DL16xC, which officially  
changed to Am29DL16xD in Revision D.  
Replaced figures with more detailed illustrations.  
Revision D+1 (June 21, 2000)  
Global  
Revision D+3 (November 22, 2000)  
Data sheet designation has changed from “Advance  
Information” to “Preliminary.”  
Global  
Deleted Preliminary status from document. Added  
table of contents.  
Trademarks  
Copyright © 2000 Advanced Micro Devices, Inc. All rights reserved.  
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.  
ExpressFlash is a trademark of Advanced Micro Devices, Inc.  
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.  
52  
Am29DL162D/163D/164D  

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