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AM27C64-200DEB PDF预览

AM27C64-200DEB

更新时间: 2024-11-14 20:20:43
品牌 Logo 应用领域
飞索 - SPANSION 可编程只读存储器电动程控只读存储器内存集成电路
页数 文件大小 规格书
12页 172K
描述
UVPROM, 8KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28

AM27C64-200DEB 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:DIP
包装说明:DIP, DIP28,.6针数:28
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.61风险等级:5.65
Is Samacsys:N最长访问时间:200 ns
I/O 类型:COMMONJESD-30 代码:R-CDIP-T28
JESD-609代码:e0长度:37.147 mm
内存密度:65536 bit内存集成电路类型:UVPROM
内存宽度:8湿度敏感等级:1
功能数量:1端子数量:28
字数:8192 words字数代码:8000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-55 °C组织:8KX8
输出特性:3-STATE封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DIP封装等效代码:DIP28,.6
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL峰值回流温度(摄氏度):240
电源:5 V编程电压:12.75 V
认证状态:Not Qualified座面最大高度:5.588 mm
最大待机电流:0.0001 A子类别:EPROMs
最大压摆率:0.025 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子面层:TIN LEAD
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:15.24 mmBase Number Matches:1

AM27C64-200DEB 数据手册

 浏览型号AM27C64-200DEB的Datasheet PDF文件第2页浏览型号AM27C64-200DEB的Datasheet PDF文件第3页浏览型号AM27C64-200DEB的Datasheet PDF文件第4页浏览型号AM27C64-200DEB的Datasheet PDF文件第5页浏览型号AM27C64-200DEB的Datasheet PDF文件第6页浏览型号AM27C64-200DEB的Datasheet PDF文件第7页 
FINAL  
Am27C64  
64 Kilobit (8 K x 8-Bit) CMOS EPROM  
DISTINCTIVE CHARACTERISTICS  
Fast access time  
Latch-up protected to 100 mA from –1 V to  
VCC + 1 V  
— Speed options as fast as 45 ns  
Low power consumption  
High noise immunity  
Versatile features for simple interfacing  
— Both CMOS and TTL input/output compatibility  
Two line control functions  
— 20 µA typical CMOS standby current  
JEDEC-approved pinout  
Single +5 V power supply  
Standard 28-pin DIP, PDIP, and 32-pin PLCC  
±10% power supply tolerance standard  
100% Flashrite™ programming  
Typical programming time of 1 second  
packages  
GENERAL DESCRIPTION  
The Am27C64 is a 64-Kbit, ultraviolet erasable pro-  
grammable read-only memory. It is organized as 8K  
words by 8 bits per word, operates from a single +5 V  
supply, has a static standby mode, and features fast  
single address location programming. Products are  
available in windowed ceramic DIP packages, as well  
as plastic one time programmable (OTP) PDIP and  
PLCC packages.  
thus eliminating bus contention in a multiple bus micro-  
processor system.  
AMD’s CMOS process technology provides high  
speed, low power, and high noise immunity. Typical  
power consumption is only 80 mW in active mode, and  
100 µW in standby mode.  
All signals are TTL levels, including programming sig-  
nals. Bit locations may be programmed singly, in  
blocks, or at random. The device supports AMD’s  
Flashrite programming algorithm (100 µs pulses), re-  
sulting in a typical programming time of 1 second.  
Data can be typically accessed in less than 45 ns, al-  
lowing high-performance microprocessors to operate  
without any WAIT states. The device offers separate  
Output Enable (OE#) and Chip Enable (CE#) controls,  
BLOCK DIAGRAM  
V
Data Outputs  
DQ0–DQ7  
CC  
V
V
SS  
PP  
OE#  
CE#  
Output Enable  
Chip Enable  
and  
Output  
Buffers  
Prog Logic  
PGM#  
Y
Y
Gating  
Decoder  
A0–A12  
Address  
Inputs  
65,538  
Bit Cell  
Matrix  
X
Decoder  
11419E-1  
Publication# 11419 Rev: E Amendment/0  
Issue Date: May 1998  

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