Datasheet > ALN0070_17

ALN0070_17

更新时间： 2024-10-31 01:18:19

品牌	Logo	应用领域
ASB		/
页数	文件大小	规格书
3页	220K
描述
Internally Matched LNA Module

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中文翻译

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数据手册

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ALN0070_17 数据手册

plerow^TMALN0070

Internally Matched LNA Module

Features

Description

The plerow^TMALN-series is the compactly designed surface-mount

module for the use of the LNA with or without the following gain blocks in

the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,

PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-

cation terminals, CATV and so on. It has an exceptional performance of

low noise figure, high gain, high OIP3, and low bias current. The stability

factor is always kept more than unity over the application band in order

to ensure its unconditionally stable implementation to the application

system environment. The surface-mount module package including the

completed matching circuit and other components necessary just in case

allows very simple and convenient implementation onto the system

board in mass production level.

· S₂₁= 35.8 dB@65 MHz

= 36.2 dB@75 MHz

· NF of 0.9 dB over Frequency

· Unconditionally Stable

· Single 5 V Supply

· High OIP3@Low Current

Specifications (in Production)

Typ.@T = 25 C, V_s= 5 V, Freq. = 70 MHz, Z_o.sys= 50 ohms

2-stage Single Type

Specifications

Typ

Parameter

Unit

Min

Max

Frequency Range

Gain

MHz

0.2

0.9

More Information

Gain Flatness

0.3

Noise Figure

0.95

Website: www.asb.co.kr

E-mail: sales@asb.co.kr

Output IP3

dBm

Tel: (82) 42-528-7223

Fax: (82) 42-528-7222

S11/S22

-18/-18

170

Output P1dB

dBm

sec

Switching Time ⁽³⁾

Supply Current

Supply Voltage

Impedance

150



Package Type & Size

Surface Mount Type, 13Wx13Lx3.8H

Operating temperature is -40C to +85C.

1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz.

2) S11/S22 (max) is the worst value within the frequency band.

3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to V_S.

Outline Drawing (Unit: mm)

Pin Number

Function

RF In

plerow

ALN0070

RF Out

ASB Inc.

Others

Ground

(Top View)

(Bottom View)

Note: 1. The number and size of ground via holes in

a circuit board is critical for thermal RF

grounding considerations.

Solder Stencil Area

2. We recommend that the ground via holes be

placed on the bottom of all ground pins for

better RF and thermal performance, as

shown in the drawing at the left side.

(Side View)

Ø 0.4 plated thru holes to ground plane

(Recommended Footprint)

1/3

www.asb.co.kr

August 2017

12 3

中文翻译

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