ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
Analog Inputs: Current .............................................. ±100mA, Momentary
±10mA, Continuous
Top View
SSOP
Voltage..................................AGND –0.3V to AVDD + 0.3V
Analog Outputs Short Circuit to Ground (+25°C) ..................... Continuous
AVDD to AGND .........................................................................–0.3V to 6V
DVDD to DGND .........................................................................–0.3V to 6V
PLLIN or PLLOUT to AGND........................................ –0.3V to AVDD + 0.3V
Digital Input Voltage to DGND ................................. –0.3V to DVDD + 0.3V
Digital Output Voltage to DGND .............................. –0.3V to DVDD + 0.3V
AGND, DGND Differential Voltage ..................................................... 0.3V
Junction Temperature (TJ) ............................................................ +150°C
Storage Temperature Range .......................................... –40°C to +125°C
Lead Temperature (soldering, 3s)................................................. +260°C
Power Dissipation ......................................................................... 700mW
AGND
AVDD
txCLK
DGND
txDAT
rxD0
1
2
3
4
5
6
7
8
9
48 PLLIN
47 PLLOUT
46 NC
45 NC
44 NC
43 NC
rxD1
42 AGND
41 txLINEP
40 AVDD
39 txLINEN
38 AGND
37 AVDD
36 REFN
35 VCM
rxD2
PACKAGE/ORDERING INFORMATION
rxD3
PACKAGE
rxD4 10
rxD5 11
DRAWING
NUMBER(1)
TEMPERATURE
RANGE
PRODUCT
PACKAGE
AFE1205E
48-Lead SSOP
333
–40°C to +85°C
DGND 12
DVDD 13
rxD6 14
AFE1205E
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
rxD7 15
34 REFP
33 AGND
32 AGND
31 rxLINEP
30 rxLINEN
29 rxHYBP
28 rxHYBN
27 AVDD
26 rxLOOP
25 rxGAIN1
rxD8 16
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
rxD9 17
rxD10 18
rxD11 19
rxD12 20
rxD13 21
PWSEL 22
rxSYNC 23
rxGAIN0 24
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
®
AFE1205
4