ADuM7703
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. All voltages are relative to
the respective GNDx.
THERMAL RESISTAN°E
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required.
Table 8.
Parameter
Rating
VDD1 to GND1
VDD2 to GND2
−0.3 V to +23 V
−0.3 V to +6 V
−1 V to +4.3 V
−0.± V to VDD2 + 0.± V
−0.± V to VDD2 + 0.± V
±10 mA
Table 9. Thermal Resistance
Package Type1
RI-ꢀ-1
θJA
ΨJ°
Unit
°C/W
°C/W
2
3
Analog Input Voltage to GND1
Digital Input Voltage to GND2
Digital Output Voltage to GND2
Input Current to Any Pin Except Supplies1
Output Current from Any Pin Except
Supplies
Operating Temperature Range
16-lead SOIC_W
ꢀ-lead SOIC_IC
Storage Temperature Range
Junction Temperature
Pb-Free Temperature, Soldering
Reflow
10±
ꢀ7.2±
9.2±
10.4
RW-16
1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board. See JEDEC JESD-±1.
2 θJA was calculated using the total power and maximum junction
temperature.
±10 mA
3 ΨJC was calculated using the package center case temperature.
−40°C to +12±°C
−40°C to +10±°C
−6±°C to +1±0°C
1±0°C
ESD °AUTION
260°C
Electrostatic Discharge (ESD)
Field Induced Charged Device Model
±12±0 V
±4000 V
(FICDM)2
Human Body Model (HBM)3
1 Transient currents of up to 100 mA do not cause silicon controlled rectifier
(SCR) to latch up.
2 JESD22-C101, resistor, capacitor (RC) network, 1 Ω, package capacitance, and
Class IV.
3 ESDA/JEDEC JS-001-2011, RC network: 1.± kΩ, 100 pF, and Class 3A.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
INSULATION RATINGS
The maximum continuous working voltage refers to the continuous voltage magnitude imposed across the isolation barrier. See the
Insulation Lifetime section for more details.
Table 10. Maximum Continuous Working Voltage
Parameter
Insulation Rating1
Lifetime °onditions
Basic Insulation
AC Voltage
Bipolar Waveform
1129 VPEAK
20 years to 1000 ppm failure at 1129 VPEAK (79ꢀ V rms, ±0 Hz or 60 Hz sine wave)
Reinforced Insulation
AC Voltage
Bipolar Waveform
1060 VPEAK
20 years to 1 ppm failure at 1060 VPEAK (7±0 V rms, ±0 Hz or 60 Hz sine wave)
1 Insulation capability without regard to creepage limitations. Working voltage may be limited by the PCB creepage when considering rms voltages for components
soldered to a PCB (assumes Material Group I up to 1270 V rms), or package: RI-ꢀ-1 package creepage of ꢀ.1 mm, and RW-16 package creepage of 7.ꢀ mm, when
considering rms voltages for Material Group I.
Rev. 0 | Page ꢀ of 22
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