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ADSP-21364KBCZ-1AA PDF预览

ADSP-21364KBCZ-1AA

更新时间: 2024-01-13 17:01:08
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
52页 2274K
描述
SHARC Processor

ADSP-21364KBCZ-1AA 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:LFBGA, BGA136,14X14,32针数:136
Reach Compliance Code:compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:1.95
其他特性:ALSO REQUIRES 3.3V SUPPLY地址总线宽度:16
桶式移位器:YES位大小:32
边界扫描:YES最大时钟频率:55.55 MHz
外部数据总线宽度:16格式:FLOATING POINT
内部总线架构:MULTIPLEJESD-30 代码:S-PBGA-B136
JESD-609代码:e1长度:12 mm
低功率模式:NO湿度敏感等级:3
端子数量:136最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA136,14X14,32
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:1.2,3.3 V
认证状态:Not QualifiedRAM(字数):98304
座面最大高度:1.7 mm子类别:Digital Signal Processors
最大供电电压:1.26 V最小供电电压:1.14 V
标称供电电压:1.2 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40宽度:12 mm
uPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHERBase Number Matches:1

ADSP-21364KBCZ-1AA 数据手册

 浏览型号ADSP-21364KBCZ-1AA的Datasheet PDF文件第46页浏览型号ADSP-21364KBCZ-1AA的Datasheet PDF文件第47页浏览型号ADSP-21364KBCZ-1AA的Datasheet PDF文件第48页浏览型号ADSP-21364KBCZ-1AA的Datasheet PDF文件第49页浏览型号ADSP-21364KBCZ-1AA的Datasheet PDF文件第50页浏览型号ADSP-21364KBCZ-1AA的Datasheet PDF文件第52页 
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366  
OUTLINE DIMENSIONS  
The ADSP-2136x is available in a 136-ball BGA package.  
10.40 BSC SQ  
12.00 BSC SQ  
0.80  
BSC  
TYP  
A
B
C
D
E
F
PIN A1 INDICATOR  
G
H
J
K
L
M
N
P
0.80  
BSC  
TYP  
14 13 12 11 10 9 8  
7 6 5 4 3 2 1  
BOTTOM VIEW  
TOP VIEW  
1.70  
MAX  
DETAIL A  
0.25  
MIN  
SEATING  
PLANE  
0.50  
0.45  
1. DIMENSIONS ARE IN MILIMETERS (MM).  
2. THE ACTUAL POSITION OF THE BALL GRID IS  
WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE  
TO THE PACKAGE EDGES.  
3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR  
THE BALL DIAMETER.  
0.40  
0.12 MAX (BALL  
COPLANARITY)  
(BALL  
DIAMETER)  
4. CENTER DIMENSIONS ARE NOMINAL.  
DETAIL A  
Figure 45. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA](BC-136-2)  
SURFACE MOUNT DESIGN  
Table 44 is provided as an aide to PCB design. For industry-  
standard design recommendations, refer to IPC-7351, Generic  
Requirements for Surface Mount Design and Land Pattern  
Standard.  
Table 44. BGA Data for Use with Surface Mount Design  
Package  
Ball Attach Type  
Solder Mask Opening  
Ball Pad Size  
136-Ball Grid Array (BC-136-2)  
Solder Mask Defined  
0.40 mm diameter  
0.53 mm diameter  
Rev. A  
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Page 51 of 52  
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December 2006  

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