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ADP160ACBZ-1.8-R7

更新时间: 2024-10-28 06:36:23
品牌 Logo 应用领域
亚德诺 - ADI 线性稳压器IC调节器电源电路输出元件PC
页数 文件大小 规格书
20页 500K
描述
Ultralow Quiescent Current, 150 mA, CMOS Linear Regulator

ADP160ACBZ-1.8-R7 数据手册

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ADP160/ADP161  
Consider the case where a hard short from OUT to ground occurs.  
At first, the ADP160/ADP161 current limits so that only ꢀ20 mA is  
conducted into the short. If self-heating of the junction is great  
enough to cause its temperature to rise above 150°C, thermal  
shutdown activates, turning off the output and reducing the  
output current to zero. As the junction temperature cools and  
drops below 1ꢀ5°C, the output turns on and conducts ꢀ20 mA  
into the short, again causing the junction temperature to rise  
above 150°C. This thermal oscillation between 1ꢀ5°C and  
150°C causes a current oscillation between ꢀ20 mA and 0 mA  
that continues as long as the short remains at the output.  
Table 9. Typical ΨJB Values  
ΨJB (°C/W)  
TSOT  
WLCSP  
42.8  
58.4  
The junction temperature of the ADP160/ADP161 can be  
calculated from the following equation:  
TJ = TA + (PD × θJA)  
(2)  
(ꢀ)  
where:  
TA is the ambient temperature.  
PD is the power dissipation in the die, given by  
Current and thermal limit protections are intended to protect  
the device against accidental overload conditions. For reliable  
operation, device power dissipation must be externally limited  
so junction temperatures do not exceed 125°C.  
PD = [(VIN VOUT) × ILOAD] + (VIN × IGND  
)
where:  
LOAD is the load current.  
GND is the ground current.  
I
I
V
THERMAL CONSIDERATIONS  
IN and VOUT are input and output voltages, respectively.  
In most applications, the ADP160/ADP161 do not dissipate  
much heat due to their high efficiency. However, in applications  
with high ambient temperature and high supply voltage to output  
voltage differential, the heat dissipated in the package is large  
enough that it can cause the junction temperature of the die to  
exceed the maximum junction temperature of 125°C.  
Power dissipation due to ground current is quite small and can be  
ignored. Therefore, the junction temperature equation simplifies to  
the following:  
TJ = TA + {[(VIN VOUT) × ILOAD] × θJA}  
(4)  
As shown in Equation 4, for a given ambient temperature, input-  
to-output voltage differential, and continuous load current, there  
exists a minimum copper size requirement for the PCB to ensure  
the junction temperature does not rise above 125°C. Figure ꢀ7 to  
Figure 44 show the junction temperature calculations for the  
different ambient temperatures, load currents, VIN-to-VOUT  
differentials, and areas of PCB copper.  
When the junction temperature exceeds 150°C, the converter enters  
thermal shutdown. It recovers only after the junction temperature  
has decreased below 1ꢀ5°C to prevent any permanent damage.  
Therefore, thermal analysis for the chosen application is very  
important to guarantee reliable performance over all conditions.  
The junction temperature of the die is the sum of the ambient  
temperature of the environment and the temperature rise of the  
package due to the power dissipation, as shown in Equation 2.  
In the case where the board temperature is known, use the  
thermal characterization parameter, ΨJB, to estimate the junction  
temperature rise (see Figure 45 and Figure 46). Maximum junction  
temperature (TJ) is calculated from the board temperature (TB)  
and power dissipation (PD) using the following formula:  
To guarantee reliable operation, the junction temperature of the  
ADP160/ADP161 must not exceed 125°C. To ensure the junction  
temperature stays below this maximum value, the user needs to  
be aware of the parameters that contribute to junction temperature  
changes. These parameters include ambient temperature, power  
dissipation in the power device, and thermal resistances between  
the junction and ambient air (θJA). The θJA number is dependent  
on the package assembly compounds that are used and the amount  
of copper used to solder the package GND pins to the PCB.  
Table 8 shows the typical θJA values of the 5-lead TSOT and the  
4-ball WLCSP for various PCB copper sizes. Table 9 shows the  
typical ΨJB value of the 5-lead TSOT and 4-ball WLCSP.  
TJ = TB + (PD × ΨJB)  
(5)  
The typical value of ΨJB is 58°C/W for the 4-ball WLCSP package  
and 4ꢀ°C/W for the 5-lead TSOT package.  
140  
MAXIMUM JUNCTION TEMPERATURE  
120  
100  
80  
Table 8. Typical θJA Values  
60  
θJA (°C/W)  
Copper Size (mm2)  
TSOT  
170  
152  
146  
134  
131  
WLCSP  
260  
159  
157  
153  
40  
01  
20  
I
I
I
= 1mA  
= 10mA  
= 50mA  
I
I
I
= 100mA  
= 150mA  
= 200mA  
LOAD  
LOAD  
LOAD  
LOAD  
LOAD  
LOAD  
50  
100  
300  
500  
0
0.3  
0.8  
1.3  
1.8  
2.3  
– V  
2.8  
(V)  
3.3  
3.8  
4.3  
4.8  
V
IN  
OUT  
151  
Figure 37. 500 mm2 of PCB Copper, WLCSP, TA = 25°C  
1 Device soldered to minimum size pin traces.  
Rev. 0 | Page 15 of 20  
 
 
 
 

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