是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | 4 X 4 MM, CSP-20 | 针数: | 20 |
Reach Compliance Code: | unknown | 风险等级: | 5.39 |
其他特性: | ALSO OPERATE WITH 1.8V TO 5.5V SINGLE SUPPLY | 模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码: | S-XQCC-N20 | JESD-609代码: | e0 |
长度: | 4 mm | 湿度敏感等级: | 3 |
负电源电压最大值(Vsup): | -2.75 V | 负电源电压最小值(Vsup): | -2.25 V |
标称负供电电压 (Vsup): | -2.5 V | 信道数量: | 8 |
功能数量: | 1 | 端子数量: | 20 |
标称断态隔离度: | 60 dB | 通态电阻匹配规范: | 0.4 Ω |
最大通态电阻 (Ron): | 4.5 Ω | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 240 |
座面最大高度: | 0.9 mm | 最大供电电压 (Vsup): | 2.75 V |
最小供电电压 (Vsup): | 2.25 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 最长断开时间: | 15 ns |
最长接通时间: | 25 ns | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 4 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
ADG758BCP-REEL | ADI |
获取价格 |
IC 8-CHANNEL, SGL ENDED MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20, Multiplexer or Switch | |
ADG758BCP-REEL7 | ROCHESTER |
获取价格 |
8-CHANNEL, SGL ENDED MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20 | |
ADG758BCPZ | ADI |
获取价格 |
3 ohm, 4-/8-Channel Multiplexers in Chip Scale Package | |
ADG758BCPZ-REEL7 | ADI |
获取价格 |
3 ohm, 4-/8-Channel Multiplexers in Chip Scale Package | |
ADG759 | ADI |
获取价格 |
3 ohm, 4-/8-Channel Multiplexers in Chip Scale Package | |
ADG759_15 | ADI |
获取价格 |
4-/8-Channel Multiplexers in Chip Scale Package | |
ADG759BCP | ADI |
获取价格 |
3 ohm, 4-/8-Channel Multiplexers in Chip Scale Package | |
ADG759BCP-REEL | ADI |
获取价格 |
IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20, Multiplexer or Switch | |
ADG759BCP-REEL | ROCHESTER |
获取价格 |
4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20 | |
ADG759BCP-REEL7 | ROCHESTER |
获取价格 |
4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC20, 4 X 4 MM, CSP-20 |