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ADC12QS065 PDF预览

ADC12QS065

更新时间: 2024-02-08 18:37:22
品牌 Logo 应用领域
德州仪器 - TI 转换器模数转换器
页数 文件大小 规格书
33页 863K
描述
四通道、12 位、65MSPS 模数转换器 (ADC)

ADC12QS065 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC60,.35SQ,20针数:60
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.26最大模拟输入电压:2 V
最小模拟输入电压:-2 V最长转换时间:0.138462 µs
转换器类型:ADC, PROPRIETARY METHODJESD-30 代码:S-PQCC-N60
JESD-609代码:e3长度:9 mm
最大线性误差 (EL):0.0342%湿度敏感等级:3
模拟输入通道数量:4位数:12
功能数量:1端子数量:60
最高工作温度:85 °C最低工作温度:-40 °C
输出位码:BINARY输出格式:SERIAL
封装主体材料:PLASTIC/EPOXY封装代码:HVQCCN
封装等效代码:LCC60,.35SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
采样速率:65 MHz采样并保持/跟踪并保持:SAMPLE
座面最大高度:0.8 mm子类别:Analog to Digital Converters
最大压摆率:200 mA标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:9 mmBase Number Matches:1

ADC12QS065 数据手册

 浏览型号ADC12QS065的Datasheet PDF文件第2页浏览型号ADC12QS065的Datasheet PDF文件第3页浏览型号ADC12QS065的Datasheet PDF文件第4页浏览型号ADC12QS065的Datasheet PDF文件第6页浏览型号ADC12QS065的Datasheet PDF文件第7页浏览型号ADC12QS065的Datasheet PDF文件第8页 
ADC12QS065  
www.ti.com  
SNOSAD6I JULY 2005REVISED APRIL 2013  
PIN DESCRIPTIONS (continued)  
Pin No.  
Symbol  
Description  
ANALOG POWER  
Positive analog supply pins. These pins should be connected to a quiet +3.3V source  
and bypassed to AGND with 0.1 µF capacitors located near these power pins, and with  
a 10 µF capacitor.  
1,15,17,19,  
58,59  
VA  
2,5,8,11,  
14,16,18,  
46,49,60  
The ground return for the analog supply.  
NOTE: The exposed pad on the WQFN package must be soldered to AGND.  
AGND  
DIGITAL POWER  
Positive digital supply pin. This pin should be connected to the same quiet +3.3V source  
as is VA and be bypassed to DGND with a 0.1 µF capacitor located near the power pin  
and with a 10 µF capacitor.  
26,53  
VD  
27, 52  
DGND  
The ground return for the digital supply.  
Positive driver supply pin for the ADC12QS065's output drivers. This pin should be  
connected to a voltage source of +2.5V to VD and be bypassed to DR GND with a 0.1  
µF capacitor. If the supply for this pin is different from the supply used for VA and VD, it  
should also be bypassed with a 10 µF capacitor. VDR should never exceed the voltage  
on VD. All bypass capacitors should be located near the supply pin.  
28, 51  
VDR  
30,35,40, 45,50  
DRGND  
The ground return for the ADC12QS065's output drivers.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)(3)(4)  
VA, VD, VDR  
3.8V  
100 mV  
|VA–VD|  
Voltage on any pin (excludes pins 29 to 45)  
Voltage on any pin (pins 29 to 45)  
Input Current at Any Pin(5)  
Package Input Current(5)  
Package Dissipation at TA = 25°C  
0.3V to (VA or VD +0.3V)  
-0.3V to 2V  
±25 mA  
±50 mA  
See(6)  
Human Body Model(7)  
Machine Model(7)  
2500V  
ESD Susceptibility  
250V  
Soldering Temperature  
Storage Temperature  
Infrared (10 sec.)(8)  
235°C  
65°C to +150°C  
(1) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.  
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is ensured to be functional, but do not ensure specific performance limits. For ensured specifications and test  
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance  
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the  
maximum Operating Ratings is not recommended.  
(3) Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.  
(4) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and  
specifications.  
(5) When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be  
limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies  
with an input current of 25 mA to two.  
(6) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by  
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula  
PDMAX = (TJmax - TA )/θJA. In the 60-pin WQFN, θJA is 20°C/W with the exposed pad soldered to a ground plane, so PDMAX = 2 W at  
the maximum operating ambient temperature of 85°C. Note that the power consumption of this device under normal operation will  
typically be about 900 mW. The values for maximum power dissipation listed above will be reached only when the device is operated in  
a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is  
reversed). Obviously, such conditions should always be avoided.  
(7) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0.  
(8) Reflow Reflow temperature profiles are different for lead-free and non-lead-free packages.  
Copyright © 2005–2013, Texas Instruments Incorporated  
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