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AD8324ACP-REEL7

更新时间： 2024-02-28 05:37:17
品牌 Logo 应用领域
亚德诺 - ADI 线路驱动器或接收器驱动程序和接口接口集成电路
页数 文件大小 规格书
16页 639K
描述
3.3 V Upstream Cable Line Driver

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AD8324ACP-REEL7 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Active零件包装代码：QFN
包装说明：4 X 4 MM, MO-220VGGD-1, CSP-20针数：20
Reach Compliance Code：unknown风险等级：5.63
差分输出：YES驱动器位数：1
输入特性：STANDARD接口集成电路类型：LINE DRIVER
接口标准：GENERAL PURPOSEJESD-30 代码：S-XQCC-N20
JESD-609代码：e0长度：4 mm
湿度敏感等级：3功能数量：1
端子数量：20最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：UNSPECIFIED
封装代码：HVQCCN封装形状：SQUARE
封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度（摄氏度）：240
座面最大高度：1 mm最大供电电压：3.47 V
最小供电电压：3.13 V标称供电电压：3.3 V
表面贴装：YES温度等级：INDUSTRIAL
端子面层：TIN LEAD端子形式：NO LEAD
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：4 mm

AD8324ACP-REEL7 数据手册

 浏览型号AD8324ACP-REEL7的Datasheet PDF文件第8页浏览型号AD8324ACP-REEL7的Datasheet PDF文件第9页浏览型号AD8324ACP-REEL7的Datasheet PDF文件第10页浏览型号AD8324ACP-REEL7的Datasheet PDF文件第12页浏览型号AD8324ACP-REEL7的Datasheet PDF文件第13页浏览型号AD8324ACP-REEL7的Datasheet PDF文件第14页 
AD8324  
V
CC  
10µF  
AD8324-JRQ  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
GND  
GND  
V
V
0.1µF  
174Ω  
CC  
CC  
3
0.1µF  
V
V
IN+  
GND  
GND  
TXEN  
4
RAMP  
TO DIPLEXER  
= 75Ω  
1:1  
5
Z
IN  
V
V
V
V
IN+  
IN–  
OUT+  
Z
= 150Ω  
IN  
6
TOKO 458PT-1556  
OUT–  
BYP  
7
GND  
8
0.1µF  
DATEN  
SDATA  
CLK  
NC  
IN–  
9
0.1µF  
SLEEP  
GND  
10  
1kΩ  
1kΩ  
1kΩ  
1kΩ  
1kΩ  
DATEN  
SDATA  
CLK  
TXEN  
SLEEP  
Figure 23. Typical Application Circuit  
Table 6. Adjacent Channel Power  
Adjacent Channel Symbol Rate (kSym/s)  
Channel Symbol Rate (kSym/s)  
160  
–63  
–63  
–64  
–67  
–70  
–72  
320  
–64  
–64  
–64  
–65  
–67  
–70  
640  
–68  
–66  
–65  
–65  
–66  
–67  
1280  
–71  
–70  
–67  
–66  
–66  
–67  
2560  
–72  
–72  
–71  
–68  
–67  
–64  
5120  
160  
320  
640  
1280  
2560  
5120  
–66  
–67  
–67  
–67  
–65  
–64  
and output traces should be adequately spaced to minimize  
coupling (crosstalk) through the board. Following these guide-  
lines will optimize the overall performance of the AD8324 in all  
applications.  
POWER SUPPLY  
The 3.3 V supply should be delivered to each of the VCC pins via  
a low impedance power bus. This ensures that each pin is at the  
same potential. The power bus should be decoupled to ground  
using a 10 µF tantalum capacitor located close to the AD8324.  
In addition to the 10 µF capacitor, VCC pins should be decoupled  
to ground with ceramic chip capacitors located close to the pins.  
The bypass pin, labeled BYP, should also be decoupled. The PCB  
should have a low impedance ground plane covering all unused  
portions of the board, except in areas of the board where input  
and output traces are in close proximity to the AD8324 and the  
output transformer. All AD8324 ground pins must be connected  
to the ground plane to ensure proper grounding of all internal  
nodes.  
INITIAL POWER-UP  
When the supply voltage is first applied to the AD8324, the gain  
of the amplifier is initially set to gain code 1. As power is first  
applied to the amplifier, the TXEN pin should be held low  
(Logic 0) to prevent forward signal transmission. After power  
has been applied to the amplifier, the gain can be set to the  
desired level by following the procedure provided in the Gain  
Programming for the AD8324 section. The TXEN pin can then  
be brought from Logic 0 to Logic 1, enabling forward signal  
transmission at the desired gain level.  
SIGNAL INTEGRITY LAYOUT CONSIDERATIONS  
RAMP PIN AND BYP PIN FEATURES  
Careful attention to printed circuit board layout details will  
prevent problems due to board parasitics. Proper RF design  
techniques are mandatory. The differential input and output  
traces should be kept as short as possible. Keeping the traces  
short will minimize parasitic capacitance and inductance, which  
is most critical between the outputs of the AD8324 and the 1:1  
output transformer. It is also critical that all differential signal  
paths be symmetrical in length and width. In addition, the input  
The RAMP pin (Pin 15) is used to control the length of the  
burst on and off transients. By default, leaving the RAMP pin  
unconnected will result in a transient that is fully compliant  
with DOCSIS 2.0 Section 6.2.21.2, Spurious Emissions During  
Burst On/Off Transients. DOCSIS requires that all between  
burst transients must be dissipated no faster than 2 µs. Adding  
capacitance to the RAMP pin will slow the dissipation even  
more.  
Rev. 0 | Page 11 of 16  
 
 
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