AD7170
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3.
Parameter
Rating
VDD to GND
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
10 mA
−40°C to +105°C
−65°C to +150°C
150°C
Table 4.
Package Type
Analog Input Voltage to GND
Reference Input Voltage to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
VINx/Digital Input Current
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Lead Temperature, Soldering
Reflow
θJA
θJC
Unit
LFCSP
48.7
2.96
°C/W
ESD CAUTION
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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