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A4403GEU-T PDF预览

A4403GEU-T

更新时间: 2024-01-07 07:33:07
品牌 Logo 应用领域
急速微 - ALLEGRO 转换器稳压器开关式稳压器或控制器电源电路开关式控制器
页数 文件大小 规格书
15页 335K
描述
Valley Current Mode Control Buck Converter

A4403GEU-T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC16,.16SQ,25针数:16
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.69
模拟集成电路 - 其他类型:SWITCHING REGULATOR控制模式:CURRENT-MODE
控制技术:PULSE FREQUENCY MODULATION最大输入电压:46 V
最小输入电压:9 VJESD-30 代码:S-XQCC-N16
JESD-609代码:e3长度:4 mm
湿度敏感等级:2功能数量:1
端子数量:16最高工作温度:105 °C
最低工作温度:-40 °C最大输出电流:4.2 A
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC16,.16SQ,25封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:0.8 mm
子类别:Switching Regulator or Controllers表面贴装:YES
切换器配置:BUCK最大切换频率:2000 kHz
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:4 mmBase Number Matches:1

A4403GEU-T 数据手册

 浏览型号A4403GEU-T的Datasheet PDF文件第9页浏览型号A4403GEU-T的Datasheet PDF文件第10页浏览型号A4403GEU-T的Datasheet PDF文件第11页浏览型号A4403GEU-T的Datasheet PDF文件第13页浏览型号A4403GEU-T的Datasheet PDF文件第14页浏览型号A4403GEU-T的Datasheet PDF文件第15页 
Valley Current Mode Control Buck Converter  
A4403  
(f) The total losses can now be estimated:  
(c) Diode capacitance turn-on loss (equation 23):  
150  
×
10–12 × 422 ×1×106  
PTOTAL = PSTAT+PDYN +PDIODECAP+PCTRL+PGATE . (26)  
PDIODECAP  
=
= 0.132 W  
2
4. The thermal impedance required for the solution can now be  
determined:  
(d) Control losses (equation 24):  
TJ TA  
PCTRL = 0.004 × 42 = 0.168 W  
(e) Gate charge losses (equation 25):  
PGATE = 5×10 –9 × 1 × 106 × 42 = 0.21 W  
(f) Total losses (equation 26):  
.
RQJA  
=
(27)  
PTOTAL  
Note that if a four-layer high thermal efficiency board is used, a  
thermal impedance of around 30°C/W can be achieved.  
Example  
PTOTAL = 0.433 + 0.504 + 0.132 + 0.168 + 0.21 = 1.447 W  
Given selected parameters:  
Thermal impedance (equation 27):  
VIN(min) = 42 V,  
115 – 70  
1.447  
VOUT = 3.3 V at 3 A,  
fSW = 1 MHz,  
RQJA  
=
= 31°C/W  
For this particular solution, a PCB with high thermal efficency is  
required to ensure the junction temperature is kept below 115°C.  
For maximum effectiveness, the PCB area underneath the thermal  
pad of the A4403 should be flooded with copper. Several thermal  
vias (say between 4 and 8) should be used to connect the thermal  
pad to the internal ground plane. If possible, a further thermal  
copper plane should be applied to the bottom side of the PCB and  
connected to the thermal pad of the A4403 through the vias.  
TA = 70°C,  
Target junction temperature, TJ = 115°C,  
Vf = 0.55 V, and  
CDIODE = 150 pF, then:  
(a) Switch static losses  
Maximum duty cycle (equation 19):  
This calculation assumes no thermal influence from other compo-  
nents. If possible, it is advisable to mount the recirculation diode  
(D1) on the reverse side of the printed circuit board. Ensure low  
impedance electrical connections are implemented between board  
layers.  
3.3 + 0.55  
D (max) =  
= 0.09  
42 + 0.55  
RDS(on) of the buck switch (equation 20):  
PCB Layout Guidelines The ground plane is largely dic-  
tated by the thermal requirements of the previous section. The  
ground-referenced power components should be referenced to a  
star ground, located away from the A4403 to minimize ground  
bounce issues.  
115 – 25  
170  
RDS(on)TJ  
= 350 × 10–3  
= 0.535 Ω  
1+  
Static loss for each switch (equation 21):  
PSTAT = 32 × 0.09 × 0.535 = 0.433 W  
(b) Switch dynamic losses (equation 22):  
A small, local, relatively quiet ground plane near the A4403  
should be used for the ground-referenced support components,  
to minimize interference effects of ground noise from the power  
circuitry. Figure 4 illustrates the recommended grounding archi-  
tecture.  
3
2
PDYN 42  
=
×
10–9 × 1000 × 103 ×1.6  
= 0.504 W  
× 5×  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
12  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  

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