Advanced v0.5
ProASIC3®E Flash Family FPGAs
with Optional Soft ARM Support
®
®
Pro (Professional) I/O
Features and Benefits
High Capacity
•
•
•
•
700 Mbps DDR, LVDS-Capable I/Os
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages – Up to 8 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V/
2.5 V/1.8 V/1.5 V, 3.3 V PCI/3.3 V PCI-X, and LVCMOS
2.5 V/5.0 V Input
•
•
•
600 k to 3 Million System Gates
108 k to 504 kbits of True Dual-Port SRAM
Up to 616 User I/Os
Reprogrammable Flash Technology
•
•
Differential I/O Standards: LVPECL, LVDS, BLVDS, and
M-LVDS
•
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
Voltage-Referenced I/O Standards: GTL+ 2.5 V/3.3 V,
GTL 2.5 V/3.3 V, HSTL Class I and II, SSTL2 Class I and II,
SSTL3 Class I and II
•
•
•
Live At Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design When Powered Off
•
•
•
•
•
•
•
•
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os
On-Chip User Nonvolatile Memory
Programmable Output Slew Rate and Drive Strength
Programmable Input Delay
•
1 kbit of FlashROM with Synchronous Interfacing
Schmitt-Trigger Option on Single-Ended Inputs
Weak Pull-Up/Down
High Performance
•
•
350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI
IEEE1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages Across the ProASIC3E Family
In-System Programming (ISP) and Security
Clock Conditioning Circuit (CCC) and PLL
•
Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE1532-
compliant)
•
•
Six CCC Blocks, Each with an Integrated PLL
Flexible Phase-Shift, Multiply/Divide, and Delay
Capabilities
®
•
FlashLock to Secure FPGA Contents
•
Wide Input Frequency Range (1.5 MHz to 350 MHz)
Low Power
SRAMs and FIFOs
•
•
•
1.5 V Core Voltage for Low Power
Support for 1.5-V-Only Systems
Low-Impedance Flash Switches
•
Variable-Aspect Ratio 4,608-Bit RAM Blocks (x1, x2, x4,
x9, x18 Organizations Available)
•
•
True Dual-Port SRAM (except x18)
24 SRAM and FIFO Configurations with Synchronous
Operation up to 350 MHz
High-Performance Routing Hierarchy
•
•
•
•
•
Segmented, Hierarchical Routing and Clock Structure
Ultra-Fast Local and Long-Line Network
Enhanced High-Speed, Very-Long-Line Network
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
Soft ARM7™ Core Support in M7 ProASIC3E
Devices
•
CoreMP7Sd (with debug) and CoreMP7S (without debug)
Table 1 •
ProASIC3E Product Family
ProASIC3E Devices
A3PE600
A3PE1500
A3PE3000
1
ARM-Enabled ProASIC3E Devices
System Gates
VersaTiles (D-Flip-Flops)
RAM kbits (1,024 bits)
4,608 Bit Blocks
M7A3PE600
M7A3PE1500
M7A3PE3000
600 k
13,824
108
24
1.5 M
38,400
270
60
3 M
75,264
504
112
1 k
FlashROM Bits
1 k
1 k
Secure (AES) ISP
Yes
Yes
Yes
2
6
6
6
CCCs with Integrated PLLs
3
18
18
18
VersaNet Globals
I/O Banks
8
8
8
Maximum User I/Os
270
439
616
Package Pins
PQFP
PQ208
FG256, FG484
PQ208
FG484, FG676
PQ208
FG484, FG896
FBGA
Notes:
1. Refer to the CoreMP7 datasheet for more information.
2. The PQ208 package has six CCCs and two PLLs.
3. Six chip (main) and three quadrant global networks are available.
4. For devices supporting lower densities, refer to the ProASIC3 Flash FPGAs datasheet.
April 2006
i
© 2006 Actel Corporation
See the Actel website for the latest version of the datasheet.