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A3PE1500-FGG676I

更新时间： 2024-11-08 20:57:03
品牌 Logo 应用领域
美高森美 - MICROSEMI 时钟栅可编程逻辑
页数 文件大小 规格书
166页 8664K
描述
Field Programmable Gate Array, 38400 CLBs, 1500000 Gates, 350MHz, 38400-Cell, CMOS, PBGA676, 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676

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A3PE1500-FGG676I 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：BGA, BGA676,26X26,40Reach Compliance Code：compliant
HTS代码：8542.39.00.01风险等级：5.3
最大时钟频率：350 MHzJESD-30 代码：S-PBGA-B676
JESD-609代码：e1长度：27 mm
湿度敏感等级：3可配置逻辑块数量：38400
等效关口数量：1500000输入次数：444
逻辑单元数量：38400输出次数：444
端子数量：676最高工作温度：85 °C
最低工作温度：-40 °C组织：38400 CLBS, 1500000 GATES
封装主体材料：PLASTIC/EPOXY封装代码：BGA
封装等效代码：BGA676,26X26,40封装形状：SQUARE
封装形式：GRID ARRAY峰值回流温度（摄氏度）：250
电源：1.5/3.3 V可编程逻辑类型：FIELD PROGRAMMABLE GATE ARRAY
认证状态：Not Qualified座面最大高度：2.44 mm
子类别：Field Programmable Gate Arrays最大供电电压：1.575 V
最小供电电压：1.425 V标称供电电压：1.5 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：1 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：40
宽度：27 mmBase Number Matches：1

A3PE1500-FGG676I 数据手册

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Revision 14  
ProASIC3E Flash Family FPGAs  
with Optional Soft ARM Support  
Features and Benefits  
Pro (Professional) I/O  
•
•
•
•
700 Mbps DDR, LVDS-Capable I/Os  
High Capacity  
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation  
Bank-Selectable I/O Voltages—up to 8 Banks per Chip  
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /  
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS  
2.5 V / 5.0 V Input  
•
•
•
600 k to 3 Million System Gates  
108 to 504 kbits of True Dual-Port SRAM  
Up to 620 User I/Os  
Reprogrammable Flash Technology  
•
•
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and  
M-LVDS  
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL  
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3  
Class I and II  
•
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS  
Process  
•
•
•
Instant On Level 0 Support  
Single-Chip Solution  
Retains Programmed Design when Powered Off  
•
•
•
•
•
•
•
•
I/O Registers on Input, Output, and Enable Paths  
Hot-Swappable and Cold Sparing I/Os  
Programmable Output Slew Rate and Drive Strength  
Programmable Input Delay  
Schmitt Trigger Option on Single-Ended Inputs  
Weak Pull-Up/-Down  
On-Chip User Nonvolatile Memory  
•
1 kbit of FlashROM with Synchronous Interfacing  
High Performance  
•
•
350 MHz System Performance  
3.3 V, 66 MHz 64-Bit PCI  
IEEE 1149.1 (JTAG) Boundary Scan Test  
Pin-Compatible Packages across the ProASIC 3E Family  
In-System Programming (ISP) and Security  
®
•
ISP Using On-Chip 128-Bit Advanced Encryption Standard  
(AES) Decryption via JTAG (IEEE 1532–compliant)  
Clock Conditioning Circuit (CCC) and PLL  
®
•
FlashLock Designed to Secure FPGA Contents  
•
•
Six CCC Blocks, Each with an Integrated PLL  
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities  
and External Feedback  
Low Power  
•
•
•
Core Voltage for Low Power  
Support for 1.5-V-Only Systems  
Low-Impedance Flash Switches  
•
Wide Input Frequency Range (1.5 MHz to 350 MHz)  
SRAMs and FIFOs  
•
Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,  
and ×18 organizations available)  
High-Performance Routing Hierarchy  
•
•
•
•
•
Segmented, Hierarchical Routing and Clock Structure  
Ultra-Fast Local and Long-Line Network  
Enhanced High-Speed, Very-Long-Line Network  
High-Performance, Low-Skew Global Network  
Architecture Supports Ultra-High Utilization  
•
•
True Dual-Port SRAM (except ×18)  
24 SRAM and FIFO Configurations with Synchronous Operation  
up to 350 MHz  
ARM® Processor Support in ProASIC3E FPGAs  
•
M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available  
with or without Debug  
Table 1-1 • ProASIC3E Product Family  
ProASIC3E Devices  
A3PE600  
A3PE1500  
A3PE3000  
1
Cortex-M1 Devices  
M1A3PE1500  
M1A3PE3000  
System Gates  
600,000  
13,824  
108  
24  
1,500,000  
3,000,000  
VersaTiles (D-flip-flops)  
RAM Kbits (1,024 bits)  
4,608-Bit Blocks  
38,400  
270  
60  
75,264  
504  
112  
1
FlashROM Kbits  
1
1
Secure (AES) ISP  
Yes  
6
Yes  
6
Yes  
6
2
CCCs with Integrated PLLs  
3
VersaNet Globals  
18  
18  
18  
I/O Banks  
8
8
8
Maximum User I/Os  
270  
444  
620  
Package Pins  
PQFP  
FBGA  
PQ208  
FG256, FG484  
PQ208  
FG484, FG676  
PQ208  
FG324, FG484, FG896  
Notes:  
1. Refer to the Cortex-M1 product brief for more information.  
2. The PQ208 package supports six CCCs and two PLLs.  
3. Six chip (main) and three quadrant global networks are available.  
4. For devices supporting lower densities, refer to the ProASIC3 Flash Family FPGAs datasheet.  
May 2014  
I
© 2013 Microsemi Corporation  
 
 
 
 
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A3PE1500-FGG676I 替代型号

型号 品牌 替代类型 描述 数据表
A3PE1500-FG676I MICROSEMI

完全替代

 Field Programmable Gate Array, 38400 CLBs, 1500000 Gates, 350MHz, 38400-Cell, CMOS, PBGA67
A3PE1500-2FG676I MICROSEMI

完全替代

 Field Programmable Gate Array, 38400 CLBs, 1500000 Gates, CMOS, PBGA676, 27 X 27 MM, 2.23

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 		Field Programmable Gate Array, 350MHz, 38400-Cell, CMOS, PBGA676
A3PE1500-FGG896 ACTEL

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A3PE1500-FPQ208 ACTEL

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 		Field Programmable Gate Array, 38400 CLBs, 1500000 Gates, 350MHz, 38400-Cell, CMOS, PQFP20
A3PE1500-FPQ896 ACTEL

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 		ProASIC3E Flash Family FPGAs
A3PE1500-FPQ896ES ACTEL

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 		ProASIC3E Flash Family FPGAs
A3PE1500-FPQ896I ACTEL

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 		ProASIC3E Flash Family FPGAs
A3PE1500-FPQ896PP ACTEL

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