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A3992SBT-

更新时间： 2024-02-14 23:36:10
品牌 Logo 应用领域
急速微 - ALLEGRO 驱动器电机
页数 文件大小 规格书
13页 477K
描述
DMOS Dual Full-Bridge Microstepping PWM Motor Driver

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A3992SBT- 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：TSSOP
包装说明：HTSSOP, TSSOP24,.25针数：24
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：1.13
Is Samacsys：N其他特性：ALSO REQUIRES 15V TO 50V VBB SUPPLY
模拟集成电路 - 其他类型：STEPPER MOTOR CONTROLLERJESD-30 代码：R-PDSO-G24
JESD-609代码：e3长度：7.8 mm
湿度敏感等级：2功能数量：1
端子数量：24最高工作温度：85 °C
最低工作温度：-20 °C最大输出电流：1.5 A
封装主体材料：PLASTIC/EPOXY封装代码：HTSSOP
封装等效代码：TSSOP24,.25封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH峰值回流温度（摄氏度）：260
电源：50 V认证状态：Not Qualified
座面最大高度：1.2 mm子类别：Motion Control Electronics
最大供电电流 (Isup)：12 mA最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：4.5 V标称供电电压 (Vsup)：5 V
表面贴装：YES技术：NMOS
温度等级：OTHER端子面层：Matte Tin (Sn)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：40
宽度：4.4 mmBase Number Matches：1

A3992SBT- 数据手册

 浏览型号A3992SBT-的Datasheet PDF文件第7页浏览型号A3992SBT-的Datasheet PDF文件第8页浏览型号A3992SBT-的Datasheet PDF文件第9页浏览型号A3992SBT-的Datasheet PDF文件第11页浏览型号A3992SBT-的Datasheet PDF文件第12页浏览型号A3992SBT-的Datasheet PDF文件第13页 
DMOS Dual Full-Bridge  
Microstepping PWM Motor Driver  
A3992  
under the device, to serve both as a low impedance  
ground point and thermal path.  
Layout. The printed circuit board should use a heavy  
groundplane. For optimum electrical and thermal  
performance, the A3992 must be soldered directly  
onto the board. On the underside of the A3992 pack-  
age is an exposed pad, which provides a path for  
enhanced thermal dissipation. The thermal pad should  
be soldered directly to an exposed surface on the PCB.  
Thermal vias are used to transfer heat to other layers  
of the PCB.  
The two input capacitors should be placed in parallel,  
and as close to the device supply pins as possible. The  
ceramic capacitor (CVBB1) should be closer to the  
pins than the bulk capacitor (CVBB2). This is neces-  
sary because the ceramic capacitor will be responsible  
for delivering the high frequency current components.  
The sense resistors, RSx, should have a very low  
impedance path to ground, because they must carry  
a large current while supporting very accurate volt-  
age measurements by the current sense comparators.  
Long ground traces will cause additional voltage  
drops, adversely affecting the ability of the compara-  
tors to accurately measure the current in the wind-  
ings. As shown in the layout below, the SENSEx pins  
have very short traces to the RSx resistors and very  
thick, low impedance traces directly to the star ground  
underneath the device.  
In order to minimize the effects of ground bounce and  
offset issues, it is important to have a low impedance  
single-point ground, known as a star ground, located  
very close to the device. By making the connection be-  
tween the pad and the ground plane directly under the  
A3992, that area becomes an ideal location for a star  
ground point. A low impedance ground will prevent  
ground bounce during high current operation and en-  
sure that the supply voltage remains stable at the input  
terminal. The recommended PCB layout, shown in the  
diagram below, illustrates how to create a star ground  
OUT1A  
1
OUT1B  
VBB  
OUT1A  
OUT1B  
GND  
U1  
VBB  
SENSE1  
VBB1  
NC  
CS1  
OUT1A  
NC  
RS1  
CS1 RS1  
OUT1B  
CP2  
CCP  
STROBE  
CLOCK  
DATA  
A3992  
PAD  
CP1  
CCP  
CVCP  
CVCP  
VCP  
GND  
GND  
ROSC  
CREG  
CREF  
REF  
OSC  
CVBB2  
CREF  
MUX  
SLEEP  
VREG  
OUT2B  
VBB2  
VDD  
ROSC  
CREG  
OUT2A  
SENSE2  
CVBB2  
CVBB1  
CVBB1  
CS2  
CVDD  
RS2  
RS2  
CS2  
OUT2B  
CVDD  
OUT2A  
VREF  
VREF  
OUT2A  
OUT2B  
LP package layout shown  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff, Box 15036  
10  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
www.allegromicro.com  
1...78910111213

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