是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | TFBGA, | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.75 |
JESD-30 代码: | S-PBGA-B288 | JESD-609代码: | e1 |
长度: | 11 mm | 湿度敏感等级: | 3 |
可配置逻辑块数量: | 4608 | 等效关口数量: | 200000 |
端子数量: | 288 | 组织: | 4608 CLBS, 200000 GATES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
认证状态: | Not Qualified | 座面最大高度: | 1.05 mm |
最大供电电压: | 1.575 V | 最小供电电压: | 1.425 V |
标称供电电压: | 1.5 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 11 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
A2F200M3D-CSG484 | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3D-CSH288 | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA288, 0.50 MM PITCH, HALO | |
A2F200M3D-CSH288I | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA288, 0.50 MM PITCH, HALO | |
A2F200M3D-CSH288Y | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA288, 0.50 MM PITCH, HALO | |
A2F200M3D-CSH288YI | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA288, 0.50 MM PITCH, HALO | |
A2F200M3D-FG208 | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3D-FG208Y | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3D-FG256 | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3D-FG256 | ACTEL |
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Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 | |
A2F200M3D-FG256I | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 |