Datasheet > A2F200M3D-FG256

A2F200M3D-FG256

更新时间： 2024-11-05 20:34:23

品牌	Logo	应用领域
ACTEL		栅可编程逻辑
页数	文件大小	规格书
170页	5851K
描述
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-256

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

A2F200M3D-FG256 技术参数

生命周期：	Transferred	包装说明：	1 MM PITCH, FBGA-256
Reach Compliance Code：	unknown	风险等级：	5.75
JESD-30 代码：	S-PBGA-B256	长度：	17 mm
可配置逻辑块数量：	4608	等效关口数量：	200000
端子数量：	256	最高工作温度：	85 °C
最低工作温度：		组织：	4608 CLBS, 200000 GATES
封装主体材料：	PLASTIC/EPOXY	封装代码：	LBGA
封装形状：	SQUARE	封装形式：	GRID ARRAY, LOW PROFILE
可编程逻辑类型：	FIELD PROGRAMMABLE GATE ARRAY	认证状态：	Not Qualified
座面最大高度：	1.7 mm	最大供电电压：	1.575 V
最小供电电压：	1.425 V	标称供电电压：	1.5 V
表面贴装：	YES	技术：	CMOS
温度等级：	OTHER	端子形式：	BALL
端子节距：	1 mm	端子位置：	BOTTOM
宽度：	17 mm	Base Number Matches：	1

A2F200M3D-FG256 数据手册

Revision 4

Actel’s SmartFusion Intelligent Mixed Signal FPGAs

–

Programmable Embedded FIFO Control Logic

Microcontroller Subsystem (MSS)

•

Secure ISP with 128-Bit AES via JTAG

FlashLock^®to Secure FPGA Contents

Five Clock Conditioning Circuits (CCCs) with up to 2

Integrated Analog PLLs

–

•

Hard 100 MHz 32-Bit ARM^®Cortex™-M3

–

1.25 DMIPS/MHz Throughput from Zero Wait State

Memory

–

Memory Protection Unit (MPU)

Phase Shift, Multiply/Divide, and Delay Capabilities

Frequency: Input 1.5–350 MHz, Output 0.75 to

350 MHz

Single Cycle Multiplication, Hardware Divide

JTAG Debug (4 wires), Serial Wire Debug (SWD, 2

wires), and Single Wire Viewer (SWV) Interfaces

•

Internal Memory

Programmable Analog

–

Embedded Nonvolatile Flash Memory (eNVM), 128

Kbytes to 512 Kbytes

Analog Front-End (AFE)

•

Up to Three 12-Bit SAR ADCs

–

Embedded High-Speed SRAM (eSRAM), 16 Kbytes

to 64 Kbytes, Implemented in 2 Physical Blocks to

–

500 Ksps in 12-Bit Mode

550 Ksps in 10-Bit Mode

600 Ksps in 8-Bit Mode

Enable Simultaneous Access from

Masters

2 Different

•

Multi-Layer AHB Communications Matrix

•

Internal 2.56

Reference

Reference or Optional External

–

Provides up to 16 Gbps of On-Chip Memory

Bandwidth,¹Allowing Multi-Master Schemes

One First-Order ΣΔ DAC (sigma-delta) per ADC

12-Bit 500 Ksps Update Rate

•

10/100 Ethernet MAC with RMII Interface²

Programmable External Memory Controller, Which

Supports:

–

Up to 5 High-Performance Analog Signal Conditioning

Blocks (SCB) per Device, Each Including:

–

Asynchronous Memories

NOR Flash, SRAM, PSRAM

Synchronous SRAMs

–

Two High-Voltage Bipolar Voltage Monitors (with 4

input ranges from ±2.5 V to –11.5/+14 V) with 1%

Accuracy

High Gain Current Monitor, Differential Gain = 50, up

to 14 V Common Mode

•

Two I²C Peripherals

–

Two 16550 Compatible UARTs

Two SPI Peripherals

Two 32-Bit Timers

32-Bit Watchdog Timer

8-Channel DMA Controller to Offload the Cortex-M3

from Data Transactions

Clock Sources

–

Temperature Monitor (Resolution = ¼°C in 12-Bit

Mode; Accurate from –55°C to 150°C)

•

Up to Ten High-Speed Voltage Comparators

(t_pd= 15 ns)

Analog Compute Engine (ACE)

•

Offloads Cortex-M3–Based MSS from Analog

Initialization and Processing of ADC, DAC, and SCBs

Sample Sequence Engine for ADC and DAC Parameter

Set-Up

•

32 KHz to 20 MHz Main Oscillator

Battery-Backed 32 KHz Low Power Oscillator with

Real-Time Counter (RTC)

100 MHz Embedded RC Oscillator; 1% Accurate

Embedded Analog PLL with 4 Output Phases (0, 90,

180, 270)

Post-Processing Engine for Functions such as Low-

Pass Filtering and Linear Transformation

Easily Configured via GUI in Libero^®Integrated Design

(IDE) Software

–

High-Performance FPGA

I/Os and Operating Voltage

•

Based on Actel's proven ProASIC^®3 FPGA Fabric

Low Power, Firm-Error Immune 130-nm, 7-Layer Metal,

Flash-Based CMOS Process

•

FPGA I/Os

–

LVDS, PCI, PCI-X, up to 24 mA I_OH/I_OL

Up to 350 MHz

•

Nonvolatile, Live at Power-Up, Retains Program When

Powered Off

•

MSS I/Os

•

350 MHz System Performance

Embedded SRAMs and FIFOs

–

Schmitt Trigger, up to 6 mA I_OH, 8 mA I_OL

Up to 180 MHz

–

Variable Aspect Ratio 4,608-Bit SRAM Blocks

x1, x2, x4, x9, and x18 Organizations

True Dual-Port SRAM (excluding x18)

•

Single 3.3 V Power Supply with On-Chip 1.5 V Regulator

External 1.5 V Is Allowed by Bypassing Regulator

(digital VCC = 1.5 V for FPGA and MSS, analog VCC =

3.3 V and 1.5 V)

1 Theoretical maximum

2 A2F200 and larger devices

September 2010

12 3 4 5 6 7...170

中文翻译

下载PDF

与A2F200M3D-FG256相关器件

型号	品牌	获取价格	描述	数据表
A2F200M3D-FG256I	MICROSEMI	获取价格	Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25
A2F200M3D-FG256Y	MICROSEMI	获取价格	SmartFusion Customizable System-on-Chip (cSoC)
A2F200M3D-FG256Y	ACTEL	获取价格	Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25
A2F200M3D-FG256YC	MICROSEMI	获取价格	FPGA
A2F200M3D-FG256YI	MICROSEMI	获取价格	Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25
A2F200M3D-FG256YI	ACTEL	获取价格	Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25
A2F200M3D-FG288	MICROSEMI	获取价格	SmartFusion Customizable System-on-Chip (cSoC)
A2F200M3D-FG484	MICROSEMI	获取价格	SmartFusion Customizable System-on-Chip (cSoC)
A2F200M3D-FG484	ACTEL	获取价格	Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, FBGA-48
A2F200M3D-FG484I	ACTEL	获取价格	Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, FBGA-48

与A2F200M3D-FG256相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

14
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

10
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

36
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

31

产品中心

服务支持

精选活动

关于我们

帮助中心

A2F200M3D-FG256

A2F200M3D-FG256 技术参数

A2F200M3D-FG256 数据手册

与A2F200M3D-FG256相关器件

与A2F200M3D-FG256相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

A2F200M3D-FG256

A2F200M3D-FG256 技术参数

A2F200M3D-FG256 数据手册

与A2F200M3D-FG256相关器件

与A2F200M3D-FG256相关文章

您还可以找

您在本页遇到什么问题？