是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | LBGA, | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.75 |
JESD-30 代码: | S-PBGA-B256 | JESD-609代码: | e1 |
长度: | 17 mm | 湿度敏感等级: | 3 |
可配置逻辑块数量: | 4608 | 等效关口数量: | 200000 |
端子数量: | 256 | 组织: | 4608 CLBS, 200000 GATES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度): | 260 | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
认证状态: | Not Qualified | 座面最大高度: | 1.7 mm |
最大供电电压: | 1.575 V | 最小供电电压: | 1.425 V |
标称供电电压: | 1.5 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 17 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
A2F200M3C-FGG288 | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3C-FGG484 | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3C-FGG484 | ACTEL |
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Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, GREEN, | |
A2F200M3C-FGG484I | MICROSEMI |
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Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, GREEN, | |
A2F200M3C-FGG484Y | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, GREEN, | |
A2F200M3C-FGG484Y | ACTEL |
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Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, GREEN, | |
A2F200M3C-FGG484YC | MICROSEMI |
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FPGA | |
A2F200M3C-FGG484YI | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, GREEN, | |
A2F200M3C-FGG484YI | ACTEL |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA484, 1 MM PITCH, GREEN, | |
A2F200M3C-FGH256 | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, HALOGEN |