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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 98K443 | ETC |
获取价格 |
MOBIL FETT HP222 20KG |
|
| 98R112SA00E | ADVANTECH |
获取价格 |
2U Storage Chassis for ATX/EATX Serverboard with 24 Hot-swap Drive Bays |
|
| 98R112SE00E | ADVANTECH |
获取价格 |
2U Storage Chassis for ATX/EATX Serverboard with 24 Hot-swap Drive Bays |
|
| 98R1748300E | ADVANTECH |
获取价格 |
4U Rackmount / Tower Chassis for EATX/ATX/MicroATX Motherboard |
|
| 98R1748310E | ADVANTECH |
获取价格 |
4U Rackmount / Tower Chassis for EATX/ATX/MicroATX Motherboard |
|
| 98R1750000E | ADVANTECH |
获取价格 |
Compact Fanless System with 6th |
|
| 98R1750010E | ADVANTECH |
获取价格 |
Compact Fanless System with 6th Gen Intel Core i Processor |
|
| 98R1750020E | ADVANTECH |
获取价格 |
Compact Fanless System with 6th Gen Intel Core i Processor |
|
| 98R1751300E | ADVANTECH |
获取价格 |
Compact Fanless System with 6th Gen Intel Core i Processor |
|
| 98R1752000E | ADVANTECH |
获取价格 |
Compact Fanless System with 6th Gen Intel Core i Processor |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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