Document Number T4240
Rev. 1, 05/2016
NXP Semiconductors
Data Sheet: Technical Data
T4240
QorIQ T4240 Data Sheet
Features
• 32 SerDes lanes at up to 10 Gb/s
• 12 e6500 cores built on Power Architecture®
technology and arranged as clusters of four e6500
cores sharing a 2 MB L2 cache
• Ethernet interfaces
– Up to four 10 Gbps Ethernet MACs
– Up to sixteen 1 Gbps Ethernet MACs
– Combinations of 1 Gbps and 10 Gbps Ethernet
MACs
• 1.5 MB CoreNet platform cache (CPC)
• Hierarchical interconnect fabric
– IEEE Std 1588™ support
– CoreNet fabric supporting coherent and non-
coherent transactions with prioritization and
bandwidth allocation amongst CoreNet end-points
– 1.6 Tbps coherent read bandwidth
• High-speed peripheral interfaces
– Four PCI Express 2.0/3.0 controllers running at up
to 8 GT/s with one controllers supporting end-point,
single-root I/O virtualization (SR-IOV)
– Two Serial RapidIO 2.0 controllers running at up to
5 Gbaud
• Three 64-bit DDR3 SDRAM memory controllers
– DDR3 and DDR3L with ECC and interleaving
support
– Interlaken look-aside interface for TCAM
connection
• Data Path Acceleration Architecture (DPAA)
incorporating acceleration for the following functions:
– Packet parsing, classification, and distribution
(Frame Manager 1.1)
• Additional peripheral interfaces
– Two Serial ATA (SATA 2.0) controllers
– Two high-speed USB 2.0 controllers with integrated
PHY
– Queue management for scheduling, packet
sequencing, and congestion management (Queue
Manager 1.1)
– Enhanced secure digital host controller (SD/MMC/
eMMC)
– Hardware buffer management for buffer allocation
and de-allocation (Buffer Manager 1.1)
– Cryptography Acceleration (SEC 5.0)
– RegEx Pattern Matching Acceleration (PME 2.0)
– Decompression/Compression Acceleration (DCE
1.0)
– Enhanced Serial peripheral interface (eSPI)
– Four I2C controllers
– Four 2-pin UARTs or two 4-pin DUARTs
– Integrated flash controller supporting NAND and
NOR flash
• Three 8-channel DMA engines
– DPAA chip-to-chip interconnect via RapidIO
Message Manager (RMan 1.0)
• 1932 FC-PBGA package, 45 mm x 45 mm, 1mm pitch
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
© 2014–2016 NXP B.V.