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87636-2012 PDF预览

87636-2012

更新时间： 2024-11-11 06:33:27
品牌 Logo 应用领域
莫仕 - MOLEX 锁存器连接器集管和边缘连接器双倍数据速率
页数 文件大小 规格书
6页 255K
描述
1.27mm (.050) Pitch DDR DIMM Socket, Vertical, Beige Latch, Single Key, with Beveled Metal Pins, 2.5V Left Voltage Key, 2.67mm (.105) Tail Length

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中文翻译

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87636-2012 技术参数

是否Rohs认证： 符合生命周期：Obsolete
Reach Compliance Code：compliant风险等级：5.83
Is Samacsys：N其他特性：LATCHED
连接器类型：CARD EDGE CONNECTOR联系完成配合：GOLD (15) OVER NICKEL
联系完成终止：TIN (75) OVER NICKEL触点性别：FEMALE
触点材料：PHOSPHOR BRONZEDIN 符合性：NO
滤波功能：NOIEC 符合性：NO
JESD-609代码：e3MIL 符合性：NO
混合触点：NO安装方式：STRAIGHT
安装类型：BOARD装载的行数：2
选件：GENERAL PURPOSE端子节距：2.54 mm
端接类型：SOLDER触点总数：184
UL 易燃性代码：94V-0Base Number Matches：1

87636-2012 数据手册

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This document was generated on 04/13/2010  
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION  
Part Number:  
Status:  
0876362002  
Active  
Description:  
1.27mm (.050") Pitch DDR DIMM Socket, Vertical, Beige Latch, Single Key, with  
Beveled Metal Pins, 2.5V Left Voltage Key, 3.23mm (.127") Tail Length, 0.38µm (15µ")  
Gold (Au) Plating, 184 Circuits, Leadfree  
Documents:  
3D Model  
Drawing (PDF)  
Product Specification PS-87736-003 (PDF)  
RoHS Certificate of Compliance (PDF)  
Series  
image - Reference only  
China RoHS  
General  
Product Family  
Series  
Memory Module Sockets  
87636  
EU RoHS  
ELV and RoHS  
Compliant  
REACH SVHC  
Not Reviewed  
Halogen-Free  
Status  
Component Type  
JEDEC Outline  
Product Name  
Memory Module  
MO-206  
DDR DIMM  
Physical  
Circuits (Loaded)  
184  
Not Halogen-Free  
Color - Resin  
Black, Natural  
Durability (mating cycles max)  
Entry Angle  
25  
Need more information on product  
environmental compliance?  
Vertical (Top Entry)  
Keying to Mating Part  
Material - Metal  
Material - Plating Mating  
Material - Plating Termination  
Material - Resin  
PC Tail Length (in)  
PC Tail Length (mm)  
PCB Retention  
Yes  
Email productcompliance@molex.com  
For a multiple part number RoHS Certificate of  
Compliance, click here  
Phosphor Bronze  
Gold  
Tin  
High Temperature Thermoplastic  
Please visit the Contact Us section for any  
non-product compliance questions.  
0.127 In  
3.23 mm  
Yes  
PCB Thickness Recommended (in)  
PCB Thickness Recommended (mm)  
Packaging Type  
0.093 In  
2.40 mm  
Tray  
0.050 In  
1.27 mm  
15  
0.375  
100  
2.5  
Search Parts in this Series  
87636Series  
Pitch - Mating Interface (in)  
Pitch - Mating Interface (mm)  
Plating min: Mating (µin)  
Plating min: Mating (µm)  
Plating min: Termination (µin)  
Plating min: Termination (µm)  
Temperature Range - Operating  
Termination Interface: Style  
Mates With  
JEDEC MO-206 modules  
-10°C to +85°C  
Through Hole  
Electrical  
Current - Maximum per Contact  
Voltage - Maximum  
Voltage Key  
1A  
50V  
2.5V, Left  
Solder Process Data  
Duration at Max. Process Temperature (seconds)  
Lead-free Process Capability  
30  
SMC & Wave Capable (TH only)  
Max. Cycles at Max. Process Temperature  
Process Temperature max. C  
1
240  
Material Info  
Reference - Drawing Numbers  
Product Specification  
PS-87736-003  
123456

中文翻译

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